Gaoqiang Jiang , Li Li , Ying Chen , Lei Huang , Xiankai Meng , Shu Huang , Jianzhong Zhou
{"title":"激光强化诱导整体加筋板应力形成与位错演化:三点弯曲循环加载下疲劳裂纹扩展行为","authors":"Gaoqiang Jiang , Li Li , Ying Chen , Lei Huang , Xiankai Meng , Shu Huang , Jianzhong Zhou","doi":"10.1016/j.optlastec.2025.113584","DOIUrl":null,"url":null,"abstract":"<div><div>A comprehensive process of forming manufacturing and fatigue performance enhancement by laser peening (LP/LPF) was proposed for integral skin structure. The forming law for integral stiffened plate was explored, and the dislocation features of typical positions after LPF was characterized. The inhibition mechanism of crack propagation by grain refinement, dislocation evolution, and compressive residual stress (CRS) implantation in typical positions induced by LP and deformation was analyzed. The fatigue crack growth behavior and fatigue life extension mechanism under three-point bending cyclic loading mode were revealed. Results revealed that the stiffener decrease the bending curvature by 17.3 times. LP causes a fine-grained layer containing high-density dislocations, accompanied by increased and coarsened second phase. The dislocation density and second phase precipitation in the compressed region only affected by CRS decrease, and many subgrains appear. Under three-point bending cyclic loading mode, the fatigue life of LPFed samples increase by 8.6, 10.6, and 11.3 times. The compressed stiffener perpendicular to crack increase the distance and area to inhibit propagation, and overlapping spots induced rough surface “guides” the deviated crack return. High-density dislocations and compressed fine grain layers implanted by LP and deformation have dislocation strengthening, fine grain strengthening, and compression toughening effects.</div></div>","PeriodicalId":19511,"journal":{"name":"Optics and Laser Technology","volume":"192 ","pages":"Article 113584"},"PeriodicalIF":4.6000,"publicationDate":"2025-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Laser peening induced stress forming and dislocation evolution of the integral stiffened plate: fatigue crack growth behavior under three-point bending cyclic loading\",\"authors\":\"Gaoqiang Jiang , Li Li , Ying Chen , Lei Huang , Xiankai Meng , Shu Huang , Jianzhong Zhou\",\"doi\":\"10.1016/j.optlastec.2025.113584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>A comprehensive process of forming manufacturing and fatigue performance enhancement by laser peening (LP/LPF) was proposed for integral skin structure. The forming law for integral stiffened plate was explored, and the dislocation features of typical positions after LPF was characterized. The inhibition mechanism of crack propagation by grain refinement, dislocation evolution, and compressive residual stress (CRS) implantation in typical positions induced by LP and deformation was analyzed. The fatigue crack growth behavior and fatigue life extension mechanism under three-point bending cyclic loading mode were revealed. Results revealed that the stiffener decrease the bending curvature by 17.3 times. LP causes a fine-grained layer containing high-density dislocations, accompanied by increased and coarsened second phase. The dislocation density and second phase precipitation in the compressed region only affected by CRS decrease, and many subgrains appear. Under three-point bending cyclic loading mode, the fatigue life of LPFed samples increase by 8.6, 10.6, and 11.3 times. The compressed stiffener perpendicular to crack increase the distance and area to inhibit propagation, and overlapping spots induced rough surface “guides” the deviated crack return. High-density dislocations and compressed fine grain layers implanted by LP and deformation have dislocation strengthening, fine grain strengthening, and compression toughening effects.</div></div>\",\"PeriodicalId\":19511,\"journal\":{\"name\":\"Optics and Laser Technology\",\"volume\":\"192 \",\"pages\":\"Article 113584\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optics and Laser Technology\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0030399225011752\",\"RegionNum\":2,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optics and Laser Technology","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0030399225011752","RegionNum":2,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"OPTICS","Score":null,"Total":0}
Laser peening induced stress forming and dislocation evolution of the integral stiffened plate: fatigue crack growth behavior under three-point bending cyclic loading
A comprehensive process of forming manufacturing and fatigue performance enhancement by laser peening (LP/LPF) was proposed for integral skin structure. The forming law for integral stiffened plate was explored, and the dislocation features of typical positions after LPF was characterized. The inhibition mechanism of crack propagation by grain refinement, dislocation evolution, and compressive residual stress (CRS) implantation in typical positions induced by LP and deformation was analyzed. The fatigue crack growth behavior and fatigue life extension mechanism under three-point bending cyclic loading mode were revealed. Results revealed that the stiffener decrease the bending curvature by 17.3 times. LP causes a fine-grained layer containing high-density dislocations, accompanied by increased and coarsened second phase. The dislocation density and second phase precipitation in the compressed region only affected by CRS decrease, and many subgrains appear. Under three-point bending cyclic loading mode, the fatigue life of LPFed samples increase by 8.6, 10.6, and 11.3 times. The compressed stiffener perpendicular to crack increase the distance and area to inhibit propagation, and overlapping spots induced rough surface “guides” the deviated crack return. High-density dislocations and compressed fine grain layers implanted by LP and deformation have dislocation strengthening, fine grain strengthening, and compression toughening effects.
期刊介绍:
Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication.
The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas:
•development in all types of lasers
•developments in optoelectronic devices and photonics
•developments in new photonics and optical concepts
•developments in conventional optics, optical instruments and components
•techniques of optical metrology, including interferometry and optical fibre sensors
•LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow
•applications of lasers to materials processing, optical NDT display (including holography) and optical communication
•research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume)
•developments in optical computing and optical information processing
•developments in new optical materials
•developments in new optical characterization methods and techniques
•developments in quantum optics
•developments in light assisted micro and nanofabrication methods and techniques
•developments in nanophotonics and biophotonics
•developments in imaging processing and systems