{"title":"封装低损耗MISL带通滤波器与通用混合耦合电路模型","authors":"Ming Yin;Kaixue Ma;Yi Wu","doi":"10.1109/TCPMT.2025.3574813","DOIUrl":null,"url":null,"abstract":"In this article, we demonstrate low-loss bandpass filters (BPFs) using two types of coupled-line structures with multilayer metal-integrated suspended line (MISL) technology. In addition, we introduce a novel circuit model that offers a straightforward and general explanation for the occurrence of transmission zeros (TZs) in mixed electric and magnetic (mixed-EM) coupling BPFs. The structure of this article is as follows. First, we introduce a new equivalent circuit model that accurately explains how multiple TZs are generated through mixed-coupling structures. At the same time, the proposed model is used to theoretically explain the cause of flat group delay. Second, we provide two specific design examples that demonstrate the flexibility in placing TZs. These examples show that TZs can be located on the right or both sides of the passband. Finally, we implement all the proposed BPFs with MISL. We conduct simulations and measurements to validate the effectiveness of the proposed theory and design techniques on the implemented BPFs. The results from both the simulations and tests confirm that filters designed based on MISL technology not only offer ease of fabrication but also possess very compact sizes with low losses.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 7","pages":"1446-1453"},"PeriodicalIF":3.0000,"publicationDate":"2025-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Packaged Low-Loss MISL Bandpass Filters With General Mixed-Coupling Circuit Model\",\"authors\":\"Ming Yin;Kaixue Ma;Yi Wu\",\"doi\":\"10.1109/TCPMT.2025.3574813\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this article, we demonstrate low-loss bandpass filters (BPFs) using two types of coupled-line structures with multilayer metal-integrated suspended line (MISL) technology. In addition, we introduce a novel circuit model that offers a straightforward and general explanation for the occurrence of transmission zeros (TZs) in mixed electric and magnetic (mixed-EM) coupling BPFs. The structure of this article is as follows. First, we introduce a new equivalent circuit model that accurately explains how multiple TZs are generated through mixed-coupling structures. At the same time, the proposed model is used to theoretically explain the cause of flat group delay. Second, we provide two specific design examples that demonstrate the flexibility in placing TZs. These examples show that TZs can be located on the right or both sides of the passband. Finally, we implement all the proposed BPFs with MISL. We conduct simulations and measurements to validate the effectiveness of the proposed theory and design techniques on the implemented BPFs. The results from both the simulations and tests confirm that filters designed based on MISL technology not only offer ease of fabrication but also possess very compact sizes with low losses.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 7\",\"pages\":\"1446-1453\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2025-03-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11017738/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11017738/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Packaged Low-Loss MISL Bandpass Filters With General Mixed-Coupling Circuit Model
In this article, we demonstrate low-loss bandpass filters (BPFs) using two types of coupled-line structures with multilayer metal-integrated suspended line (MISL) technology. In addition, we introduce a novel circuit model that offers a straightforward and general explanation for the occurrence of transmission zeros (TZs) in mixed electric and magnetic (mixed-EM) coupling BPFs. The structure of this article is as follows. First, we introduce a new equivalent circuit model that accurately explains how multiple TZs are generated through mixed-coupling structures. At the same time, the proposed model is used to theoretically explain the cause of flat group delay. Second, we provide two specific design examples that demonstrate the flexibility in placing TZs. These examples show that TZs can be located on the right or both sides of the passband. Finally, we implement all the proposed BPFs with MISL. We conduct simulations and measurements to validate the effectiveness of the proposed theory and design techniques on the implemented BPFs. The results from both the simulations and tests confirm that filters designed based on MISL technology not only offer ease of fabrication but also possess very compact sizes with low losses.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.