电力电子烧结模键合用独立式纳米银带箔及其功率循环可靠性

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-07-07 DOI:10.1016/j.microrel.2025.115860

Xinda Wang , Yanli Xu , Wei Guo , Zilong Peng , Hongqiang Zhang , Xingwen Zhou

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引用次数: 0

摘要

银纳米材料由于其优异的热稳定性和高导电性，被认为是一种很有前途的电力电子连接材料。本文研究了一种由低有机含量纳米带组成的独立银中间层，用于电力电子器件的烧结模键合。烧结后的接头抗剪强度为29.4 MPa，孔隙率为5.2%，导热系数较高。这些优异的性能归功于特殊的烧结工艺和银纳米带的桥接效应。特别是，面对面的连接为银原子提供了较高的绿色密度和更多的扩散路径，从而形成了致密的银接头。这种独立的银中间层在电子封装中具有可行性和性能，在恶劣条件下具有良好的功率循环可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Free-standing silver nanobelt foils for sintering die bonding of power electronics and its power cycle reliability

Silver nanomaterials are considered as promising joining materials for power electronics due to their excellent thermo-stability and high electrical/thermal conductivity. In this work, a free-standing silver interlayer composed of nanobelts with low organic content is used for sintering die bonding of power electronics. The sintered joints exhibit a high shear strength of 29.4 MPa, a low porosity of 5.2 % and high thermal conductivity. These remarkable properties are attributed to the special sintering process and bridging effect of the silver nanobelts. Especially, the face-to-face connection provides a high green density and more diffusion paths for the silver atoms, resulting in a dense silver joint. This free-standing Ag interlayer shows feasibility and capability in electronic packaging and good power cycle reliability under harsh conditions.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.