基于短开载(SOL)技术的λ/4 SISL谐振器低损耗自封装带通滤波器综合设计

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shuangxu Li;Lei Zhu;Kaixue Ma
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引用次数: 0

摘要

本文提出了一种基于低损耗四分之一波长($\lambda $ /4)衬底集成悬索线(SISL)谐振器的高效、精确的带通滤波器(bpf)综合设计方法,该方法采用短开负载(SOL)校准技术。BPF拓扑由两侧壁上有两体积过孔的SISL和基于SISL的交替J/K逆变器组成。首先,借助全波仿真,分析了周期性加载引脚的SISL的传播特性,并通过SOL进行了提取。然后,为了方便滤波器的综合设计,准确提取了各J/K逆变器对称/不对称馈线的等效电路参数。其中,电路测量的多余过渡可以直接合并到$J_{01}$逆变器的输入端口,然后作为误差盒由SOL校准出来,从而可以实现包含馈电过渡的SISL BPF的高效协同设计。最后,设计并制作了两个具有$\ λ $ /4谐振腔的四阶全极切比雪夫SISL bpf。所有实现的SISL bpf的合成、仿真和测量结果都很一致,充分证明了SOL技术在设计SISL电路中的有效性。此外,与传统的平面bpf相比,SISL bpf具有低损耗和自封装的优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Synthesis Design of Low-Loss and Self-Packaged Bandpass Filter on λ/4 SISL Resonators Using the Short-Open-Load (SOL) Technique
In this article, an efficient and accurate synthesis design method for bandpass filters (BPFs) based on low-loss quarter-wavelength ( $\lambda $ /4) substrate integrated suspended line (SISL) resonators is proposed, using the short-open-load (SOL) calibration technique. The BPF topology is comprised of SISL with two volumes of vias on both side walls and alternating SISL-based J/K inverters. First, with the help of full-wave simulation, the propagation characteristics of the SISL with periodically loaded pins are analyzed and extracted by SOL. Afterward, to facilitate the filter synthesis design, the equivalent circuit parameters of each J/K inverter with symmetrical/asymmetrical feed lines are accurately extracted. Herein, the extra transition for circuit measurement can be directly merged into the input port of the $J_{01}$ inverter and then be regarded as an error box to be calibrated out by SOL. Therefore, the efficient co-design of the resultant SISL BPF containing the feed transition can be achieved. Finally, two 4th-order all-pole Chebyshev SISL BPFs with $\lambda $ /4 resonators are designed and fabricated. The synthesized, simulated, and measured results of all the implemented SISL BPFs are found in good agreement, evidently demonstrating the effectiveness of the SOL technique for designing the SISL circuits. In addition, the SISL BPFs have the advantages of low loss and self-packaging against traditional planar BPFs.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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