Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices

This study describes the design of a radiator for use in microelectronic components. The suggested technology depends on generating electrostatic force by using the electric bias on the electrodes, which takes effect on the coolant within the radiator. The coolant vortex of the radiator is created by combining the structural design and the potential difference across the electrodes, and the electronic devices positioned at the top of the radiator can perform cooling and heat transfer. This idea is the foundation for the finite element simulation, which simulates the coolant flow and heat transfer in the radiator under electrostatic force, and the influence of other factors, such as channel diameter and spacing, is also investigated. Furthermore, the radiator is manufactured using the 3-D printing technique. The radiator is examined using charge and discharge, and a rudimentary implementation of the role of managing the coolant flow of the radiator is exhibited. The equipment controls the rate of radiator coolant by voltage and has low energy consumption as well as a handy and compact form.