用于检测电力变换器控制电子设备中湿度引起的故障的状态监测

IF 1.9 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-06-24 DOI:10.1016/j.microrel.2025.115832

F. Sehr, S. Wagner, A. Schulz, A. Vorwerk

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引用次数: 0

摘要

本文提出了一种通过检测印刷电路板上的湿气结构变化来预测潮湿环境下电源变换器故障的状态监测系统。为此，提出了可能的失效机制和可能的状态监测概念。随后，一种状态监测概念被开发出来，将电化学迁移作为主要的故障机制，通过使用梳状结构作为状态指示器或金丝雀来检测潜在的故障。设计了一种合适的电路，包括用于诱导电化学迁移的高压电源和用于测量表面绝缘电阻的跨阻放大器，使用最小数量的公共元件和PCB空间。该电路作为原型实现，并进行了表征和长期测量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Condition monitoring for detection of humidity-induced failures in control electronics of power converters

This paper presents a condition monitoring system for predicting failures of power converters in humid environments by detection of moisture-induced structural changes on printed circuit boards. To this end, probable failure mechanisms and possible condition monitoring concepts are presented. Subsequently, a condition monitoring concept is developed that targets electrochemical migration as a dominant failure mechanism, detecting potential failures by using comb structures as condition indicators or canaries. A suitable circuit is designed, consisting of a high voltage supply for inducing electrochemical migration and a transimpedance amplifier to measure surface insulation resistance, using a minimum number of common components and PCB space. The circuit is realized as a prototype and subjected to characterization and long-term measurements.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.