导电薄膜电阻率温度系数和热膨胀系数的测量

IF 2 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS

Thin Solid Films Pub Date : 2025-06-16 DOI:10.1016/j.tsf.2025.140727

Gerhard Fischerauer

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引用次数: 0

摘要

分析了从测量到的支撑基板上的薄膜电阻器的电阻温度系数中提取薄膜材料的电阻率温度系数和热膨胀系数的细节。结果表明，这需要两个应变实验，一个热实验，以及在两个已知性质的不同衬底上沉积相同薄膜的能力。对文献中实验数据的分析，包括应用测量不确定度表达指南（GUM）的公认规则，表明违反规定的要求通常会导致不一致或任意的结果。

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On measuring the temperature coefficient of resistivity and the thermal expansion coefficient of conductive thin films

We analyze the details of extracting the temperature coefficient of resistivity and the thermal expansion coefficient of thin-film materials from the measured temperature coefficient of resistance of thin-film resistors on supporting substrates. It is shown that this requires two straining experiments, one thermal experiment, and the ability to deposit identical films on two different substrates with known properties. An analysis of experimental data from the literature, which includes the application of accepted rules from the Guide to the Expression of Uncertainty in Measurement (GUM), reveals that the violation of the stated requirements usually leads to inconsistent or arbitrary results.

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来源期刊

Thin Solid Films 工程技术-材料科学：膜

CiteScore

4.00

自引率

4.80%

发文量

381

审稿时长

7.5 months

期刊介绍： Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.