{"title":"脉冲激光沉积非晶p型n掺杂Ga₂O₃在薄膜晶体管和同结二极管中的应用","authors":"Teng-Min Fan;Chen Wang;Cong Yi;Chen-Hao Zhou;Yu-Li Su;Yun-Shao Cho;Dong-Sing Wuu;Shui-Yang Lien","doi":"10.1109/TDMR.2025.3559225","DOIUrl":null,"url":null,"abstract":"In this study, an amorphous p-type N-doped Ga2O3 thin film has been achieved using pulsed laser deposition and Ga2O3:GaN=1:1 (at%) mixed ceramic target. The bonding states of the films after nitrogen incorporation were investigated using X-ray photoelectron spectroscopy, which revealed the lattice oxygen sites substituted by nitrogen. Ultraviolet photoelectron spectroscopy analysis shows a p-type feature of N-doped Ga2O3 film and a weak n-type unintentional doped pure Ga2O3 film. The thin film transistors have been fabricated using pure and N-doped Ga2O3 films to further confirm their n-type and p-type conductive properties, respectively. The N-doped Ga2O3-based TFTs displays p-type characteristics with a field effect mobility of <inline-formula> <tex-math>$2.13\\times 10{^{\\text {-3}}}$ </tex-math></inline-formula> cm2/V<inline-formula> <tex-math>$\\cdot $ </tex-math></inline-formula>s, an on/off ratio of <inline-formula> <tex-math>$2.78\\times 10{^{{4}}}$ </tex-math></inline-formula> and a sub-threshold swing of 0.15 V/dec. Finally, a full amorphous Ga2O3 films-based pn homojunction diode has been fulfilled and explored in detail, which displays a good rectifying characteristic with a rectification ratio of <inline-formula> <tex-math>$1.46\\times 10{^{{2}}}$ </tex-math></inline-formula> and an ideality factor of 5.19.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 2","pages":"281-287"},"PeriodicalIF":2.3000,"publicationDate":"2025-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Achievement of Pulse Laser Deposited Amorphous P-Type N-Doped Ga₂O₃ for Applying in Thin Film Transistor and Homojunction Diode\",\"authors\":\"Teng-Min Fan;Chen Wang;Cong Yi;Chen-Hao Zhou;Yu-Li Su;Yun-Shao Cho;Dong-Sing Wuu;Shui-Yang Lien\",\"doi\":\"10.1109/TDMR.2025.3559225\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, an amorphous p-type N-doped Ga2O3 thin film has been achieved using pulsed laser deposition and Ga2O3:GaN=1:1 (at%) mixed ceramic target. The bonding states of the films after nitrogen incorporation were investigated using X-ray photoelectron spectroscopy, which revealed the lattice oxygen sites substituted by nitrogen. Ultraviolet photoelectron spectroscopy analysis shows a p-type feature of N-doped Ga2O3 film and a weak n-type unintentional doped pure Ga2O3 film. The thin film transistors have been fabricated using pure and N-doped Ga2O3 films to further confirm their n-type and p-type conductive properties, respectively. The N-doped Ga2O3-based TFTs displays p-type characteristics with a field effect mobility of <inline-formula> <tex-math>$2.13\\\\times 10{^{\\\\text {-3}}}$ </tex-math></inline-formula> cm2/V<inline-formula> <tex-math>$\\\\cdot $ </tex-math></inline-formula>s, an on/off ratio of <inline-formula> <tex-math>$2.78\\\\times 10{^{{4}}}$ </tex-math></inline-formula> and a sub-threshold swing of 0.15 V/dec. Finally, a full amorphous Ga2O3 films-based pn homojunction diode has been fulfilled and explored in detail, which displays a good rectifying characteristic with a rectification ratio of <inline-formula> <tex-math>$1.46\\\\times 10{^{{2}}}$ </tex-math></inline-formula> and an ideality factor of 5.19.\",\"PeriodicalId\":448,\"journal\":{\"name\":\"IEEE Transactions on Device and Materials Reliability\",\"volume\":\"25 2\",\"pages\":\"281-287\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2025-04-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Device and Materials Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10960308/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10960308/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
The Achievement of Pulse Laser Deposited Amorphous P-Type N-Doped Ga₂O₃ for Applying in Thin Film Transistor and Homojunction Diode
In this study, an amorphous p-type N-doped Ga2O3 thin film has been achieved using pulsed laser deposition and Ga2O3:GaN=1:1 (at%) mixed ceramic target. The bonding states of the films after nitrogen incorporation were investigated using X-ray photoelectron spectroscopy, which revealed the lattice oxygen sites substituted by nitrogen. Ultraviolet photoelectron spectroscopy analysis shows a p-type feature of N-doped Ga2O3 film and a weak n-type unintentional doped pure Ga2O3 film. The thin film transistors have been fabricated using pure and N-doped Ga2O3 films to further confirm their n-type and p-type conductive properties, respectively. The N-doped Ga2O3-based TFTs displays p-type characteristics with a field effect mobility of $2.13\times 10{^{\text {-3}}}$ cm2/V$\cdot $ s, an on/off ratio of $2.78\times 10{^{{4}}}$ and a sub-threshold swing of 0.15 V/dec. Finally, a full amorphous Ga2O3 films-based pn homojunction diode has been fulfilled and explored in detail, which displays a good rectifying characteristic with a rectification ratio of $1.46\times 10{^{{2}}}$ and an ideality factor of 5.19.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.