{"title":"基于机器学习的翅片散热器热建模代理模型","authors":"Z. Wang, Y. Zhang, H. Wang","doi":"10.1016/j.microrel.2025.115775","DOIUrl":null,"url":null,"abstract":"<div><div>With the continuous increase in power density in modern power converter, there is a growing focus on thermal system design, as its performance is a key factor influencing power density and determining the reliability of power converter. As the main heat dissipation component in the power conversion field, the heatsink plays a significant role in improving the reliability of power converters. However, it is difficult to forecast the accurate thermal performance of the device in field use. Thus, the purpose of this work is to present and propose a methodology for heatsink modeling that are based on high-performance computing and machine learning. The developed ML-based surrogate models can predict the thermal performances of the heatsink without a complicated analytical model.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"172 ","pages":"Article 115775"},"PeriodicalIF":1.9000,"publicationDate":"2025-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Machine learning-based surrogate models for finned heatsink thermal modeling\",\"authors\":\"Z. Wang, Y. Zhang, H. Wang\",\"doi\":\"10.1016/j.microrel.2025.115775\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>With the continuous increase in power density in modern power converter, there is a growing focus on thermal system design, as its performance is a key factor influencing power density and determining the reliability of power converter. As the main heat dissipation component in the power conversion field, the heatsink plays a significant role in improving the reliability of power converters. However, it is difficult to forecast the accurate thermal performance of the device in field use. Thus, the purpose of this work is to present and propose a methodology for heatsink modeling that are based on high-performance computing and machine learning. The developed ML-based surrogate models can predict the thermal performances of the heatsink without a complicated analytical model.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"172 \",\"pages\":\"Article 115775\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2025-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S002627142500188X\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S002627142500188X","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Machine learning-based surrogate models for finned heatsink thermal modeling
With the continuous increase in power density in modern power converter, there is a growing focus on thermal system design, as its performance is a key factor influencing power density and determining the reliability of power converter. As the main heat dissipation component in the power conversion field, the heatsink plays a significant role in improving the reliability of power converters. However, it is difficult to forecast the accurate thermal performance of the device in field use. Thus, the purpose of this work is to present and propose a methodology for heatsink modeling that are based on high-performance computing and machine learning. The developed ML-based surrogate models can predict the thermal performances of the heatsink without a complicated analytical model.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.