Daria M. Sedlovets , Vitaly V. Starkov , Vassa V. Ulianova
{"title":"改进纳米多孔硅微电容的n掺杂类石墨烯涂层","authors":"Daria M. Sedlovets , Vitaly V. Starkov , Vassa V. Ulianova","doi":"10.1016/j.mssp.2025.109741","DOIUrl":null,"url":null,"abstract":"<div><div>Silicon wafers are the main platform for the integrating of electronic devices, porous silicon (pSi) is a promising material for on-chip microcapacitor electrodes. A method is proposed to improve the electrochemical efficiency of pSi by depositing a nitrogen-doped graphene-like coating (N-GLC) on it. N-GLC is first used to coat the entire 80 μm pSi layer. The sharp pressure drops during chemical vapor deposition (CVD) of N-GLC allow N-doped carbon to be deposited throughout the full depth of the pores. Graphitic N (the main configuration of nitrogen in N-GLC) enhances the conductivity of the composite. Moreover, the influence of GLC penetration depth in pSi on its capacitance is investigated.</div><div>Electrochemical impedance spectra, cyclic voltammetry, and galvanostatic charge-discharge data in 3M H<sub>2</sub>SO<sub>4</sub> are presented along with the results of cyclic stability measurements. High capacitance (145 mF/cm<sup>2</sup>) and excellent cyclic stability (over 20,000 cycles even at low scan rates) are achieved for a pSi microcapacitor electrode. Considerably higher values have been reported only in ionic electrolytes and/or with an additional MnO<sub>x</sub> coating on silicon nanowires – morphologically similar materials that require complicated technology.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"198 ","pages":"Article 109741"},"PeriodicalIF":4.6000,"publicationDate":"2025-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"N-doped graphene-like coating for improved microcapacitance of nanoporous silicon\",\"authors\":\"Daria M. Sedlovets , Vitaly V. Starkov , Vassa V. Ulianova\",\"doi\":\"10.1016/j.mssp.2025.109741\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Silicon wafers are the main platform for the integrating of electronic devices, porous silicon (pSi) is a promising material for on-chip microcapacitor electrodes. A method is proposed to improve the electrochemical efficiency of pSi by depositing a nitrogen-doped graphene-like coating (N-GLC) on it. N-GLC is first used to coat the entire 80 μm pSi layer. The sharp pressure drops during chemical vapor deposition (CVD) of N-GLC allow N-doped carbon to be deposited throughout the full depth of the pores. Graphitic N (the main configuration of nitrogen in N-GLC) enhances the conductivity of the composite. Moreover, the influence of GLC penetration depth in pSi on its capacitance is investigated.</div><div>Electrochemical impedance spectra, cyclic voltammetry, and galvanostatic charge-discharge data in 3M H<sub>2</sub>SO<sub>4</sub> are presented along with the results of cyclic stability measurements. High capacitance (145 mF/cm<sup>2</sup>) and excellent cyclic stability (over 20,000 cycles even at low scan rates) are achieved for a pSi microcapacitor electrode. Considerably higher values have been reported only in ionic electrolytes and/or with an additional MnO<sub>x</sub> coating on silicon nanowires – morphologically similar materials that require complicated technology.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"198 \",\"pages\":\"Article 109741\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125004780\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125004780","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
N-doped graphene-like coating for improved microcapacitance of nanoporous silicon
Silicon wafers are the main platform for the integrating of electronic devices, porous silicon (pSi) is a promising material for on-chip microcapacitor electrodes. A method is proposed to improve the electrochemical efficiency of pSi by depositing a nitrogen-doped graphene-like coating (N-GLC) on it. N-GLC is first used to coat the entire 80 μm pSi layer. The sharp pressure drops during chemical vapor deposition (CVD) of N-GLC allow N-doped carbon to be deposited throughout the full depth of the pores. Graphitic N (the main configuration of nitrogen in N-GLC) enhances the conductivity of the composite. Moreover, the influence of GLC penetration depth in pSi on its capacitance is investigated.
Electrochemical impedance spectra, cyclic voltammetry, and galvanostatic charge-discharge data in 3M H2SO4 are presented along with the results of cyclic stability measurements. High capacitance (145 mF/cm2) and excellent cyclic stability (over 20,000 cycles even at low scan rates) are achieved for a pSi microcapacitor electrode. Considerably higher values have been reported only in ionic electrolytes and/or with an additional MnOx coating on silicon nanowires – morphologically similar materials that require complicated technology.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.