级联GaN hemt在单脉冲浪涌电流应力下失效机理的研究

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Weihao Lu;Sheng Li;Weixiong Mao;Yanfeng Ma;Mingfei Li;Jie Ma;Ran Ye;Jiaxing Wei;Long Zhang;Chi Zhang;Siyang Liu;Weifeng Sun
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引用次数: 0

摘要

当Cascode氮化镓(GaN)高电子迁移率晶体管(hemt)工作在第三象限时,浪涌电流能力成为实际应用的关键参数之一。本文研究了650 V Cascode GaN HEMT在单脉冲浪涌电流作用下的失效行为和机理。对比实验结果表明,在高浪涌电流及其产生的浪涌电压升高的驱动下,耗尽模式(d模式)GaN HEMT发生不可逆失效。进一步的物理失效分析定位了漏极周围的失效点。此外,通过混合模式模拟,验证了焦耳热量在漏极周围迅速积累并最终导致器件烧毁。此外,还证明了器件漏极金属衬垫的良好散热可以提高浪涌电流能力,这为Cascode GaN hemt在第三象限工作时提供了易于实现的优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigations Into Failure Mechanism of Cascode GaN HEMTs Under Single Pulse Surge Current Stress
When Cascode gallium nitride (GaN) high-electron-mobility transistors (HEMTs) operate in the third quadrant, the surge current capability becomes one of the key parameters for practical applications. In this article, the failure behavior and mechanism of a 650 V Cascode GaN HEMT under single-pulse surge current stress are investigated. Comparative experimental results demonstrate that the irreversible failure occurs in the depletion-mode (D-mode) GaN HEMT, driven by high surge current and its resultant increasing surge voltage. Further physical failure analysis localized the failure point around the drain electrode. Moreover, by mixed-mode simulations, it is validated that joule heat accumulates rapidly around the drain electrode and eventually causes the device to burn out. Besides, it is proved that better heat dissipation for drain metal pads of devices improves the surge current capability, which provides an easy-to implement optimization for Cascode GaN HEMTs when operating in the third quadrant.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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