{"title":"具有增强导通能力的常关hemt型双极p-FET","authors":"Chengcai Wang;Jinjin Tang;Junting Chen;Jun Ma;Mengyuan Hua","doi":"10.1109/TED.2025.3559906","DOIUrl":null,"url":null,"abstract":"A normally-OFF HEMT-based bipolar p-channel field-effect transistor (NH-BiPFET) structure is proposed to enlarge the conduction current density of GaN-based p-channel transistors. In the NH-BiPFET, a normally-OFF p-GaN gate high-electron-mobility transistor (HEMT) is cascaded with a conventional p-channel field-effect transistor (p-FET), leveraging electrons as majority carriers to enhance conduction current substantially. As a result, the drain current density in NH-BiPFET increases to 43.91 mA/mm, approximately 34 times higher than that of a conventional p-FET. Moreover, the NH-BiPFET maintains a high <inline-formula> <tex-math>${I}_{\\text {ON}}$ </tex-math></inline-formula>/<inline-formula> <tex-math>${I}_{\\text {OFF}}$ </tex-math></inline-formula> ratio and a low gate leakage current comparable to the conventional p-FETs. However, the analysis of switching performance reveals that the slow discharging rate of the floating node between the p-GaN gate and the p-FET drain can lead to a prolonged turn-off transient. To address this issue, an enhanced configuration (ENH-BiPFET) consisting of the NH-BiPFET and an additional HEMT device is further proposed. Even with one more HEMT device, the complementary logic (CL) inverter based on ENH-BiPFET can still save 43.8% area compared to the conventional CL inverters, while maintaining the same operation speed.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"2884-2890"},"PeriodicalIF":2.9000,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Normally-Off HEMT-Based Bipolar p-FET With Enhanced Conduction Capability\",\"authors\":\"Chengcai Wang;Jinjin Tang;Junting Chen;Jun Ma;Mengyuan Hua\",\"doi\":\"10.1109/TED.2025.3559906\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A normally-OFF HEMT-based bipolar p-channel field-effect transistor (NH-BiPFET) structure is proposed to enlarge the conduction current density of GaN-based p-channel transistors. In the NH-BiPFET, a normally-OFF p-GaN gate high-electron-mobility transistor (HEMT) is cascaded with a conventional p-channel field-effect transistor (p-FET), leveraging electrons as majority carriers to enhance conduction current substantially. As a result, the drain current density in NH-BiPFET increases to 43.91 mA/mm, approximately 34 times higher than that of a conventional p-FET. Moreover, the NH-BiPFET maintains a high <inline-formula> <tex-math>${I}_{\\\\text {ON}}$ </tex-math></inline-formula>/<inline-formula> <tex-math>${I}_{\\\\text {OFF}}$ </tex-math></inline-formula> ratio and a low gate leakage current comparable to the conventional p-FETs. However, the analysis of switching performance reveals that the slow discharging rate of the floating node between the p-GaN gate and the p-FET drain can lead to a prolonged turn-off transient. To address this issue, an enhanced configuration (ENH-BiPFET) consisting of the NH-BiPFET and an additional HEMT device is further proposed. Even with one more HEMT device, the complementary logic (CL) inverter based on ENH-BiPFET can still save 43.8% area compared to the conventional CL inverters, while maintaining the same operation speed.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"72 6\",\"pages\":\"2884-2890\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2025-04-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10972347/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10972347/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Normally-Off HEMT-Based Bipolar p-FET With Enhanced Conduction Capability
A normally-OFF HEMT-based bipolar p-channel field-effect transistor (NH-BiPFET) structure is proposed to enlarge the conduction current density of GaN-based p-channel transistors. In the NH-BiPFET, a normally-OFF p-GaN gate high-electron-mobility transistor (HEMT) is cascaded with a conventional p-channel field-effect transistor (p-FET), leveraging electrons as majority carriers to enhance conduction current substantially. As a result, the drain current density in NH-BiPFET increases to 43.91 mA/mm, approximately 34 times higher than that of a conventional p-FET. Moreover, the NH-BiPFET maintains a high ${I}_{\text {ON}}$ /${I}_{\text {OFF}}$ ratio and a low gate leakage current comparable to the conventional p-FETs. However, the analysis of switching performance reveals that the slow discharging rate of the floating node between the p-GaN gate and the p-FET drain can lead to a prolonged turn-off transient. To address this issue, an enhanced configuration (ENH-BiPFET) consisting of the NH-BiPFET and an additional HEMT device is further proposed. Even with one more HEMT device, the complementary logic (CL) inverter based on ENH-BiPFET can still save 43.8% area compared to the conventional CL inverters, while maintaining the same operation speed.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.