栅极偏置对自热负电容场效应晶体管的影响

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yangjin Jung;Hyeongu Lee;Mincheol Shin
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引用次数: 0

摘要

通过自洽求解非平衡格林函数(NEGF)、时变金兹堡-朗道(TDGL)方程、泊松方程和热方程,研究了具有自热效应的栅极-全负电容场效应晶体管(gaa - ncfet)的性能。SHE引起的局部热点降低了铁电材料的性能,导致导通电流(${I}_{\ mathm {\scriptstyle {on}}}$)降低了约30%。为了减轻这种热退化,本文提出了一种门偏置结构,该结构可以改善亚阈值摆幅(SS),并增加${I}_{\ maththrm {\scriptstyle {ON}}}$。栅极偏置在减小漏极引起的势垒上升方面也很有效,但它降低了截止频率,在性能值(FOM)之间呈现出一种权衡关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Gate Offset on Negative Capacitance Field-Effect Transistors With Self-Heating Effect
We have investigated the performance of gate-all-around negative-capacitance field effect transistors (GAA-NCFETs) with self-heating effects (SHEs) by self-consistently solving nonequilibrium Green’s function (NEGF), time-dependent Ginzburg-Landau (TDGL) equation, Poisson’s equation, and heat equation. The local hot spot caused by SHE degrades the performance of the ferroelectric material, resulting in a reduction of the on current ( ${I}_{\mathrm {\scriptstyle {ON}}}$ ) by approximately 30%. To mitigate this thermal degradation, a gate offset structure is proposed in this work, which leads to an improvement in the subthreshold swing (SS) and an increase in the ${I}_{\mathrm {\scriptstyle {ON}}}$ . The gate offset is also effective in reducing the drain-induced barrier rising, but it decreases the cut-off frequency, presenting a trade-off relationship between the figure of merit (FOM).
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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