用于中红外高性能应用的inassb基nBn结构的制备和暗电流分析

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Bingfeng Liu;Lianqing Zhu;Lidan Lu;Weiqiang Chen;Ruixin Gong;Yang Chen;Mingli Dong
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引用次数: 0

摘要

本研究提出了用于高温(HOT)中波长红外(MWIR)应用的基于inassb的nBn结构的全面表征和暗电流分析。采用分子束外延法(MBE)生长不同Sb成分的InAsSb层,实现了晶格匹配和位错密度的最小化。采用高分辨率x射线衍射(HRXRD)、原子力显微镜(AFM)和互反空间映射(RSM)来评估晶体质量、应变松弛和表面形貌,表明优化的生长条件有显著改善。所制备的nBn光电探测器具有晶格匹配的AlAsSb势垒,在130 K时具有低暗电流密度,为4.5\ × 10^{-{4}}$ a /cm2,在190 K时为2.6\ × 10^{-{4}}$ a /cm2。黑体校准光电流谱证实了InAsSb MWIR光电探测器在160 K时表现出优异的性能,峰值量子效率(QE)为58%,响应率为1.69 a /W,探测率为2.13\ × 10^{{11}}$ cm Hz1/2/W,探测率为3.58~\mu $ m,显示了它们在高温红外探测应用中的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication and Dark Current Analysis of InAsSb-Based nBn Structures for High-Performance Mid-Infrared Applications
This study presents a comprehensive characterization and dark current analysis of InAsSb-based nBn structures for high operating temperature (HOT) mid-wavelength infrared (MWIR) applications. InAsSb layers with varying Sb compositions were grown by molecular beam epitaxy (MBE) to achieve lattice match and minimize dislocation density. High-resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM), and reciprocal space mapping (RSM) were employed to assess crystal quality, strain relaxation, and surface morphology, demonstrating significant improvements with optimized growth conditions. The fabricated nBn photodetectors, featuring a lattice-matched AlAsSb barrier, exhibited a low dark current density of $4.5\times 10^{-{5}}$ A/cm2 at 130 K and $2.6\times 10^{-{4}}$ A/cm2 at 190 K. Blackbody-calibrated photocurrent spectroscopy confirmed that the InAsSb MWIR photodetectors exhibited excellent performance at 160 K, achieving peak quantum efficiency (QE) of 58%, a responsivity of 1.69 A/W, and a detectivity of $2.13\times 10^{{11}}$ cm Hz1/2/W at $3.58~\mu $ m, demonstrating their potential for high-temperature infrared detection applications.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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