Wenyang Ding, Jiang Guo, Meng An, Koji Tsuda, Junichiro Shiomi
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Human–AI collaboration for modeling heat conduction in nanostructures
Materials informatics, which combines data science and artificial intelligence (AI), has garnered significant attention owing to its ability to accelerate material development. However, human involvement is often limited to the initiation and oversight of machine learning processes and rarely includes roles that capitalize on human intuition or domain expertise. In this study, taking the problem of heat conduction in a two-dimensional nanostructure as a case study, an integrated human-AI collaboration framework is designed and used to construct a model to predict the thermal conductivity. This approach is used to determine the parameters that govern phonon transmission over frequencies and incidence angles. The self-learning entropic population annealing technique, which combines entropic sampling with a surrogate machine learning model, generates a global dataset that can be interpreted by a human. This allows humans to develop parameters with physical interpretations, which can guide nanostructural design for specific properties.
期刊介绍:
npj Computational Materials is a high-quality open access journal from Nature Research that publishes research papers applying computational approaches for the design of new materials and enhancing our understanding of existing ones. The journal also welcomes papers on new computational techniques and the refinement of current approaches that support these aims, as well as experimental papers that complement computational findings.
Some key features of npj Computational Materials include a 2-year impact factor of 12.241 (2021), article downloads of 1,138,590 (2021), and a fast turnaround time of 11 days from submission to the first editorial decision. The journal is indexed in various databases and services, including Chemical Abstracts Service (ACS), Astrophysics Data System (ADS), Current Contents/Physical, Chemical and Earth Sciences, Journal Citation Reports/Science Edition, SCOPUS, EI Compendex, INSPEC, Google Scholar, SCImago, DOAJ, CNKI, and Science Citation Index Expanded (SCIE), among others.