Jungwook Min , Tae-Yong Park , Juchan Hwang , Hyeongmun Kim , Ibrahim G. Alsayoud , Redha H. Al Ibrahim , Jongmin Kim , Boon S. Ooi , Chul Kang , Kwangwook Park
{"title":"纳米多孔氮化镓作为器件光学活性介质的形成时间优化和评价","authors":"Jungwook Min , Tae-Yong Park , Juchan Hwang , Hyeongmun Kim , Ibrahim G. Alsayoud , Redha H. Al Ibrahim , Jongmin Kim , Boon S. Ooi , Chul Kang , Kwangwook Park","doi":"10.1016/j.mssp.2025.109696","DOIUrl":null,"url":null,"abstract":"<div><div>Nanoporous GaN (NP-GaN) embeds sub-nanoscale air gaps (n ≈ 1) that greatly expand refractive-index modulation for ultra-thin distributed Bragg reflectors (DBRs), boost surface area for photoelectrochemical (PEC) reactions, alleviate substrate lattice constraints to enable high-In red light emitting diodes (LEDs), and have even been applied in photovoltaic cells. Yet its use as an optically active medium is scarcely reported, making comprehensive evaluation of its optical and structural properties imperative for broader device integration. Herein, we report the potential of NP-GaN as an optically active medium for device applications by evaluating the optical and structural properties of NP-GaN samples etched for durations ranging from 5 to 15 min. Our results show that the average pore diameter does not increase significantly when the etching duration exceeds 10 min due to pore wall passivation by Ga-related byproducts. Meanwhile, the highest carrier lifetime and the strongest integrated near-band edge (NBE) intensity were observed in the NP-GaN sample etched for 10 min, which was attributed to pore branching. Overall, a 10 min etching duration, resulting in superior optical properties, was optimal for the formation of NP-GaN. With its advantages in optical properties with a higher active surface area compared to bulk thin films, NP-GaN optimization of etching duration provides insight into the realization of various device applications. This is not limited to GaN but extends to other nitrides such as InGaN and AlGaN, broadening the available bandgap range.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"197 ","pages":"Article 109696"},"PeriodicalIF":4.2000,"publicationDate":"2025-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Formation time optimization and evaluation of nanoporous GaN as an optically active medium for device applications\",\"authors\":\"Jungwook Min , Tae-Yong Park , Juchan Hwang , Hyeongmun Kim , Ibrahim G. Alsayoud , Redha H. Al Ibrahim , Jongmin Kim , Boon S. Ooi , Chul Kang , Kwangwook Park\",\"doi\":\"10.1016/j.mssp.2025.109696\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Nanoporous GaN (NP-GaN) embeds sub-nanoscale air gaps (n ≈ 1) that greatly expand refractive-index modulation for ultra-thin distributed Bragg reflectors (DBRs), boost surface area for photoelectrochemical (PEC) reactions, alleviate substrate lattice constraints to enable high-In red light emitting diodes (LEDs), and have even been applied in photovoltaic cells. Yet its use as an optically active medium is scarcely reported, making comprehensive evaluation of its optical and structural properties imperative for broader device integration. Herein, we report the potential of NP-GaN as an optically active medium for device applications by evaluating the optical and structural properties of NP-GaN samples etched for durations ranging from 5 to 15 min. Our results show that the average pore diameter does not increase significantly when the etching duration exceeds 10 min due to pore wall passivation by Ga-related byproducts. Meanwhile, the highest carrier lifetime and the strongest integrated near-band edge (NBE) intensity were observed in the NP-GaN sample etched for 10 min, which was attributed to pore branching. Overall, a 10 min etching duration, resulting in superior optical properties, was optimal for the formation of NP-GaN. With its advantages in optical properties with a higher active surface area compared to bulk thin films, NP-GaN optimization of etching duration provides insight into the realization of various device applications. This is not limited to GaN but extends to other nitrides such as InGaN and AlGaN, broadening the available bandgap range.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"197 \",\"pages\":\"Article 109696\"},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2025-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125004330\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125004330","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Formation time optimization and evaluation of nanoporous GaN as an optically active medium for device applications
Nanoporous GaN (NP-GaN) embeds sub-nanoscale air gaps (n ≈ 1) that greatly expand refractive-index modulation for ultra-thin distributed Bragg reflectors (DBRs), boost surface area for photoelectrochemical (PEC) reactions, alleviate substrate lattice constraints to enable high-In red light emitting diodes (LEDs), and have even been applied in photovoltaic cells. Yet its use as an optically active medium is scarcely reported, making comprehensive evaluation of its optical and structural properties imperative for broader device integration. Herein, we report the potential of NP-GaN as an optically active medium for device applications by evaluating the optical and structural properties of NP-GaN samples etched for durations ranging from 5 to 15 min. Our results show that the average pore diameter does not increase significantly when the etching duration exceeds 10 min due to pore wall passivation by Ga-related byproducts. Meanwhile, the highest carrier lifetime and the strongest integrated near-band edge (NBE) intensity were observed in the NP-GaN sample etched for 10 min, which was attributed to pore branching. Overall, a 10 min etching duration, resulting in superior optical properties, was optimal for the formation of NP-GaN. With its advantages in optical properties with a higher active surface area compared to bulk thin films, NP-GaN optimization of etching duration provides insight into the realization of various device applications. This is not limited to GaN but extends to other nitrides such as InGaN and AlGaN, broadening the available bandgap range.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.