基于统一2DEG密度表达式的p-GaN栅极hemt的CV和I-V特性分析建模

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Lili Zhang, Yanan Yin, Yiwu Qiu, Tao Wang, Pingwei Zhang, Xinjie Zhou
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引用次数: 0

摘要

这项工作提出了一个基于物理的p-GaN栅极高电子迁移率晶体管(hemt)的分析模型,通过Schrödinger-Poisson方程的自一致解开发。该模型明确地解释了整个器件的电压分布,重点关注金属/p-GaN肖特基结和AlGaN势垒层上的电压降。综合分析了几种因素对p-GaN栅极hemt电特性的影响。研究的因素包括AlGaN/GaN界面的净极化电荷密度、AlGaN势垒中向外扩散的Mg受体密度以及无意掺杂GaN缓冲层中的耗尽电荷密度。此外,导出了二维电子气体(2DEG)电荷密度的统一表达式,该表达式适用于所有操作区域。在此基础上,导出了栅极电容和漏极电流的表达式。模型的可信性通过在三个p-GaN栅极HEMT样品中建模和测量的CV和I-V特性之间的一致性得到验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analytical modeling of CV and I-V characteristics in p-GaN gate HEMTs based on the unified 2DEG density expression
This work proposes a physics-based analytical model for p-GaN gate high electron mobility transistors (HEMTs), developed through a self-consistent solution of the Schrödinger-Poisson equations. The model explicitly accounts for voltage distribution across the device, focusing on voltage drops across the metal/p-GaN Schottky junction and the AlGaN barrier layer. A comprehensive analysis is conducted to evaluate the impact of several factors on the electrical characteristics of p-GaN gate HEMTs. The investigated factors include the net polarization charge density at the AlGaN/GaN interface, out-diffused Mg acceptor density in the AlGaN barrier, and depletion charge density in the unintentionally doped GaN (UID-GaN) buffer layer. Furthermore, a unified expression for the two-dimensional electron gas (2DEG) charge density is derived, which is valid across all operation regions. On this basis, expressions for gate capacitance and drain current are developed. The model's credibility is validated by the agreement between modeled and measured CV and I-V characteristics across three p-GaN gate HEMT samples.
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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