机械应力对基于igzo的柔性基集成1T1M电学特性的影响

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Seung Joo Myoung;Hyunkyu Lee;Dong Hyeop Shin;Youngjin Seo;Wonjung Kim;Jung Rae Cho;Changwook Kim;Jong-Ho Bae;Sung-Jin Choi;Dong Myong Kim;Ickhyun Song;Dae Hwan Kim
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引用次数: 0

摘要

本研究将铟镓锌氧化物(InGaZnO, IGZO)薄膜晶体管(TFTs)和忆阻器集成为一个晶体管-一个忆阻器(1T1M)结构,并对其电学特性进行了分析。制造过程包括在柔性衬底上形成IGZO tft和在tft上沉积忆阻器。对于整体结构,考虑到基材的柔韧性,进行了不同弯曲半径(10和15 mm)和弯曲循环(0、10、100和200次)的机械应力测试。实验结果表明,随着弯曲半径的减小和弯曲次数的增加,1T1M结构的电导率受到负面影响。特别是,当弯曲半径为10mm时,晶体管的电学特性显著降低,电导率降低。电导率的下降导致修正国家标准与技术研究所(MNIST)数据库模式识别模拟的准确性明显下降,这表明对柔性电子设备的可靠性有重大影响。本研究为增强柔性神经形态计算应用的整体特性提供了有价值的材料和结构设计见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Mechanical Stress on Electrical Characteristics of IGZO-Based Integrated 1T1M on Flexible Substrate
In this study, indium-gallium-zinc oxide (InGaZnO, IGZO) thin-film transistors (TFTs) and memristors are integrated as one transistor-one memristor (1T1M) structure on flexible substrate, and its electrical characteristics are analyzed. The fabrication process includes the formation of IGZO TFTs on flexible substrates and the deposition of memristors on top of TFTs. For the integrated structure, mechanical stress testing with various bending radius (10 and 15 mm) and bending cycles (0, 10, 100, and 200 times) were applied, considering the flexibility of the substrate. Experimental results show that as the bending radius decreased and the bending cycles increased, the conductivity of the 1T1M structure was negatively affected. In particular, with a bending radius of 10 mm, the electrical characteristics of the transistor significantly were degraded, exhibiting reduced conductivity. Degradations in conductivity led to noticeable performance loss in the accuracy of Modified National Institute of Standards and Technology (MNIST) database pattern-recognition simulations, indicating significant impact on the reliability of flexible electronic devices. This study provides valuable insights into material and structural design for enhancing the overall characteristics of flexible neuromorphic computing applications.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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