A. Cavaliere , N. Modolo , C. De Santi , G. Meneghesso , E. Zanoni , M. Meneghini
{"title":"GaN miss - hemt在off状态应力下的超快速恢复瞬态","authors":"A. Cavaliere , N. Modolo , C. De Santi , G. Meneghesso , E. Zanoni , M. Meneghini","doi":"10.1016/j.microrel.2025.115790","DOIUrl":null,"url":null,"abstract":"<div><div>We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the V<sub>TH</sub> (70 %) that occurs in <10 μs, while the remaining V<sub>TH</sub> is recovered in about 100 s.</div><div>With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"171 ","pages":"Article 115790"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress\",\"authors\":\"A. Cavaliere , N. Modolo , C. De Santi , G. Meneghesso , E. Zanoni , M. Meneghini\",\"doi\":\"10.1016/j.microrel.2025.115790\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the V<sub>TH</sub> (70 %) that occurs in <10 μs, while the remaining V<sub>TH</sub> is recovered in about 100 s.</div><div>With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"171 \",\"pages\":\"Article 115790\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2025-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271425002033\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425002033","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress
We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the VTH (70 %) that occurs in <10 μs, while the remaining VTH is recovered in about 100 s.
With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.