GaN miss - hemt在off状态应力下的超快速恢复瞬态

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
A. Cavaliere , N. Modolo , C. De Santi , G. Meneghesso , E. Zanoni , M. Meneghini
{"title":"GaN miss - hemt在off状态应力下的超快速恢复瞬态","authors":"A. Cavaliere ,&nbsp;N. Modolo ,&nbsp;C. De Santi ,&nbsp;G. Meneghesso ,&nbsp;E. Zanoni ,&nbsp;M. Meneghini","doi":"10.1016/j.microrel.2025.115790","DOIUrl":null,"url":null,"abstract":"<div><div>We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the V<sub>TH</sub> (70 %) that occurs in &lt;10 μs, while the remaining V<sub>TH</sub> is recovered in about 100 s.</div><div>With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":"171 ","pages":"Article 115790"},"PeriodicalIF":1.6000,"publicationDate":"2025-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress\",\"authors\":\"A. Cavaliere ,&nbsp;N. Modolo ,&nbsp;C. De Santi ,&nbsp;G. Meneghesso ,&nbsp;E. Zanoni ,&nbsp;M. Meneghini\",\"doi\":\"10.1016/j.microrel.2025.115790\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the V<sub>TH</sub> (70 %) that occurs in &lt;10 μs, while the remaining V<sub>TH</sub> is recovered in about 100 s.</div><div>With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.</div></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":\"171 \",\"pages\":\"Article 115790\"},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2025-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271425002033\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271425002033","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

我们研究了在电源应用中正常开启(NON) mish - hemt中由OFF状态应力条件引起的退化。通过自定义设置,通过考虑应力期间阈值电压值随时间的变化和随后的恢复阶段来跟踪设备的状态。在胁迫和恢复之间的过渡过程中,我们观察到VTH在10 μs内立即部分恢复(70%),而剩余的VTH在100 μs左右恢复。通过专门的分析,我们第一次成功地研究了这种超快速恢复瞬态,我们观察到来自2DEG的电子与电离供体的重组是这种动态的原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress
We investigate the degradation induced by an OFF state stress condition in normally-on (NON) MIS-HEMTs for power applications. The state of the devices was tracked by considering the shift in the threshold voltage value over time during the stress and the following recovery phase by means of a custom setup. During the transition between stress and recovery, we observed an immediate partial recovery of the VTH (70 %) that occurs in <10 μs, while the remaining VTH is recovered in about 100 s.
With a dedicated analysis, we managed to investigate this ultra-fast recovery transient for the first time, and we observed that the recombination of electrons from 2DEG with ionized donors is responsible for this dynamic.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信