{"title":"具有增强的导态电流和低亚阈值摆幅的硅锗轴向异质结RFET","authors":"Pengjun Wan;Bo Zhang;Yuxin Ran;Siying Zheng;Yi Li;Jiuren Zhou;Jie Liang","doi":"10.1109/TED.2025.3556111","DOIUrl":null,"url":null,"abstract":"This article investigates Si and Ge dual-gate reconfigurable field-effect transistors (DG-RFETs) at the nanoscale. It is found that while the Ge DG-RFET improves the <sc>on</small>-state saturated current (<inline-formula> <tex-math>${I}_{\\text {ON} }$ </tex-math></inline-formula>) of the Si DG-RFET, it also generates bipolar currents at low voltages, which increase as the device size decreases. By analyzing the conduction mechanism of the DG-RFET and examining the source of the bipolar currents in Ge DG-RFETs, we propose a silicon-germanium axial heterojunction RFET (Si-Ge AH-RFET). The conduction mechanism was investigated in detail by Sentaurus TCAD, which revealed a unique double-tunneling mechanism in the P-program. Simulation results show that compared with Si DG-RFETs, <inline-formula> <tex-math>${I}_{\\text {ON} }$ </tex-math></inline-formula> of the proposed Si-Ge AH-RFET is improved by approximately eight times in the N-program and about 11 times in the P-program and the subthreshold swing (SS) is significantly reduced. Meanwhile, it does not exhibit the same bipolar currents at low voltages as the Ge DG-RFET and maintains the low leakage current (<inline-formula> <tex-math>${I}_{\\text {OFF} }$ </tex-math></inline-formula>) as the Si DG-RFET. Furthermore, compared with the Si DG-RFET, the transmission delay of the Si-Ge AH-RFET-based inverter is reduced by approximately 75%.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 5","pages":"2640-2646"},"PeriodicalIF":2.9000,"publicationDate":"2025-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Si–Ge Axial Heterojunction RFET With Enhanced On-State Current and Low Subthreshold Swing\",\"authors\":\"Pengjun Wan;Bo Zhang;Yuxin Ran;Siying Zheng;Yi Li;Jiuren Zhou;Jie Liang\",\"doi\":\"10.1109/TED.2025.3556111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article investigates Si and Ge dual-gate reconfigurable field-effect transistors (DG-RFETs) at the nanoscale. It is found that while the Ge DG-RFET improves the <sc>on</small>-state saturated current (<inline-formula> <tex-math>${I}_{\\\\text {ON} }$ </tex-math></inline-formula>) of the Si DG-RFET, it also generates bipolar currents at low voltages, which increase as the device size decreases. By analyzing the conduction mechanism of the DG-RFET and examining the source of the bipolar currents in Ge DG-RFETs, we propose a silicon-germanium axial heterojunction RFET (Si-Ge AH-RFET). The conduction mechanism was investigated in detail by Sentaurus TCAD, which revealed a unique double-tunneling mechanism in the P-program. Simulation results show that compared with Si DG-RFETs, <inline-formula> <tex-math>${I}_{\\\\text {ON} }$ </tex-math></inline-formula> of the proposed Si-Ge AH-RFET is improved by approximately eight times in the N-program and about 11 times in the P-program and the subthreshold swing (SS) is significantly reduced. Meanwhile, it does not exhibit the same bipolar currents at low voltages as the Ge DG-RFET and maintains the low leakage current (<inline-formula> <tex-math>${I}_{\\\\text {OFF} }$ </tex-math></inline-formula>) as the Si DG-RFET. Furthermore, compared with the Si DG-RFET, the transmission delay of the Si-Ge AH-RFET-based inverter is reduced by approximately 75%.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"72 5\",\"pages\":\"2640-2646\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2025-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10966058/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10966058/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Si–Ge Axial Heterojunction RFET With Enhanced On-State Current and Low Subthreshold Swing
This article investigates Si and Ge dual-gate reconfigurable field-effect transistors (DG-RFETs) at the nanoscale. It is found that while the Ge DG-RFET improves the on-state saturated current (${I}_{\text {ON} }$ ) of the Si DG-RFET, it also generates bipolar currents at low voltages, which increase as the device size decreases. By analyzing the conduction mechanism of the DG-RFET and examining the source of the bipolar currents in Ge DG-RFETs, we propose a silicon-germanium axial heterojunction RFET (Si-Ge AH-RFET). The conduction mechanism was investigated in detail by Sentaurus TCAD, which revealed a unique double-tunneling mechanism in the P-program. Simulation results show that compared with Si DG-RFETs, ${I}_{\text {ON} }$ of the proposed Si-Ge AH-RFET is improved by approximately eight times in the N-program and about 11 times in the P-program and the subthreshold swing (SS) is significantly reduced. Meanwhile, it does not exhibit the same bipolar currents at low voltages as the Ge DG-RFET and maintains the low leakage current (${I}_{\text {OFF} }$ ) as the Si DG-RFET. Furthermore, compared with the Si DG-RFET, the transmission delay of the Si-Ge AH-RFET-based inverter is reduced by approximately 75%.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.