相变存储器中具有低漂移电阻的超长无扰动读操作

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ruoqin Wang;Jia Zheng;Ruobing Wang;Chenchen Xie;Li Xie;Xi Li;Zhitang Song;Xilin Zhou
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引用次数: 0

摘要

内存中计算对读取存储设备的持久性要求比写入高几个数量级。在新兴的记忆技术中,读取干扰引起的记忆细胞电阻变化是神经网络应用面临的一个关键挑战。由读电压产生的电流引起相变存储器(PCM)电池的局部加热,导致有源相变体积的结构位移,从而引起电池电阻的明显变化。在这项工作中,研究了在不同的写入周期后,读取对PCM的高电阻和低电阻状态(HRS和LRS)的影响。在$27~^{\circ}$ C和$85~^{\circ}$ C下分别经历108次写入周期的存储单元上,演示了一种高达1012个读取周期(~28 h)的无扰动读取方案。通过将读取电压提高到0.5 V,观察到电阻漂移减少,进一步提高了读取的速度和精度。这项工作表明,基于碳掺杂的ge2sb2te5的PCM是一种有前途的内存中计算应用的候选者,需要高精度的大量读取。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultra-Long Disturb-Free Read Operation With Low Resistance Drift in Phase Change Memory
Compute-in-memory requires long endurance in reading of memory device orders of magnitude higher than writing. Variations in resistance of memory cells caused by read disturbance is a critical challenge for neural networks applications of emerging memory technology. Current generated by read voltage causes localized heating in the phase change memory (PCM) cell, which results in structural displacement of active phase change volume and thus appreciable variation in cell resistance. In this work, the effects of reading on both high and low resistance states (HRS and LRS) of PCM after various writing cycles are investigated. A disturb-free read scheme is demonstrated up to 1012 read cycles (~28 h) on the memory cells that experienced 108 write cycles both at $27~^{\circ }$ C and $85~^{\circ }$ C. The reduced resistance drift by increasing the read voltage up to 0.5 V is observed which further improves the speed and accuracy of reading. This work shows that carbon-doped Ge2Sb2Te5-based PCM is a promising candidate for compute-in-memory application that requires enormous reading with high-precision.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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