光学设置激光辅助键与通过硅显微镜的能力

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-02 DOI:10.1109/TCPMT.2025.3557118

Aleksandr A. Vlasov;Topi Uusitalo;Evgenii Lepukhov;Jukka Viheriälä;Mircea Guina

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引用次数: 0

摘要

现代光子集成工艺对高精度键合组装装置的设计和功能提出了严格的要求。在这项研究中，我们提出了采用底部照射/照明架构的激光辅助键合（LAB）装置的发展。主要目标是演示在LAB过程中实现光子波导对齐的通过硅成像能力。成像是通过一种新的光学装置来实现的，这种装置也用于同时照射激光束的传输。演示了III/V芯片与硅光子（SiPh）集成电路的概念验证LAB集成。

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Optical Setup for Laser-Assisted Bonding With Through-Silicon Microscopy Capabilities

The modern processes for photonic integration impose stringent demands on the design and functionality of high precision bonding assembly setups. In this study, we present the development of a laser-assisted bonding (LAB) setup employing bottom irradiation/illumination architectures. The main goal is to demonstrate through-silicon imaging capability enabling alignment of photonic waveguides during the LAB process. The imaging is achieved with a novel optical set-up used also for the simultaneous irradiation laser beam delivery. A proof-of-concept LAB integration of a III/V chip to silicon photonic (SiPh) integrated circuit is demonstrated.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.