基于涡流抓取器的非接触式芯片拾取过程仿真与实验分析

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Peiran Zhai;Zhoulong Xu;Zhouping Yin;Xiaohang Li;Bin Xie;Hao Wu
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引用次数: 0

摘要

作为芯片到晶圆(C2W)混合键合的前一个过程,晶片拾取和转移是三维异构集成(3D HI)技术的关键。特别是随着模具厚度的不断缩小和模具表面凸起的不断增加,传统的接触式拾取工艺对芯片造成的机械划伤和静电干扰是不能容忍的。因此,采用非接触式拾取头实现芯片的无损传输是大势所趋。本文设计了一种基于涡流的非接触式气动拾取头,实现了50~ μ m超薄芯片的高效非接触式抓取。在拾取头的四角设计了挡板结构,可以实现目标芯片的稳定非接触拾取,并在多角度加载条件下保持位置。此外,我们优化了挡板结构,使芯片的振荡降低了50%以上。通过三种湍流模型的计算流体动力学(CFD)模拟,探讨了气动非接触式拾取的潜在机理。在此基础上,建立了高精度涡流平台,研究了不同进气压力下的吸振力特性、径向压力分布和振荡对非接触吸振效果的影响。仿真和实验结果表明,稳定非接触式拾取的最佳进气压力为20 ~ 30 kPa。本研究为芯片的稳定非接触拾取提供了设计和优化方法,为实际应用中最佳进气压力的选择提供了理论和实验依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper
As the preceding process of chip-to-wafer (C2W) hybrid bonding, die pick-up, and transfer are critical in 3D heterogeneous integration (3D HI) technique. Especially, with the ever-shrinking die thickness and ever-increasing bumps on the die surface, mechanical scratches and electrostatic interference on chips caused by the traditional contact-type pickup process cannot be tolerated. Therefore, it is the trend to implement contactless pickup head to realize damage-free chip transfer. Herein, a contactless, pneumatic pickup head based on vortex flow was designed for the efficient and contactless grab of $50~\mu $ m ultrathin chips. A baffle structure on the four corners of pickup head was designed, which can achieve stable noncontact pickup of target chip and maintain the position under multiangle loading conditions. Furthermore, we optimized baffle structure to reduce the oscillation of the chip by more than 50%. We explored the underlying mechanism of pneumatic noncontact pickup through computational fluid dynamics (CFD) simulation by three turbulence models. Further, a high-precision vortex platform was built to investigate the pickup force characteristics, radial pressure distribution, and oscillations for different intake pressure and their influence on the noncontact pickup effect. Eventually, the simulation and experimental results indicate that the optimal intake pressure for stable non-contact pickup is between 20 and 30 kPa. This study provides design and optimization methods for stable noncontact picking of microchips, offering theoretical and experimental basis for selecting the optimal air intake pressure in practical applications.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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