{"title":"si基VCT DRAM中的位线锤击:一种新的安全挑战及解决方法","authors":"Yong Liu;Da Wang;Pengpeng Ren;Runsheng Wang;Zhigang Ji;Ru Huang","doi":"10.1109/LED.2025.3548560","DOIUrl":null,"url":null,"abstract":"We introduce the Bit Line Hammer (BL hammer) effect, a serious disturbance mechanism in 4F2 DRAM with Si-based Vertical Channel Transistors (VCT). We demonstrate that a specifically designed BL attack pattern, featuring asymmetry and an appropriate toggling frequency, can trigger numerous bit-flips under JEDEC standards, especially at elevated temperatures. This uncovers an unexplored security vulnerability in VCT DRAM cells, with implications for data integrity in advanced memory technologies. Finally, we propose a mitigation strategy to improve cell’s resistance to the BL hammering.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 5","pages":"733-736"},"PeriodicalIF":4.1000,"publicationDate":"2025-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Bit Line Hammering in Si-Based VCT DRAM: A New Security Challenge and Its Mitigation\",\"authors\":\"Yong Liu;Da Wang;Pengpeng Ren;Runsheng Wang;Zhigang Ji;Ru Huang\",\"doi\":\"10.1109/LED.2025.3548560\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We introduce the Bit Line Hammer (BL hammer) effect, a serious disturbance mechanism in 4F2 DRAM with Si-based Vertical Channel Transistors (VCT). We demonstrate that a specifically designed BL attack pattern, featuring asymmetry and an appropriate toggling frequency, can trigger numerous bit-flips under JEDEC standards, especially at elevated temperatures. This uncovers an unexplored security vulnerability in VCT DRAM cells, with implications for data integrity in advanced memory technologies. Finally, we propose a mitigation strategy to improve cell’s resistance to the BL hammering.\",\"PeriodicalId\":13198,\"journal\":{\"name\":\"IEEE Electron Device Letters\",\"volume\":\"46 5\",\"pages\":\"733-736\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2025-03-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electron Device Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10912451/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10912451/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Bit Line Hammering in Si-Based VCT DRAM: A New Security Challenge and Its Mitigation
We introduce the Bit Line Hammer (BL hammer) effect, a serious disturbance mechanism in 4F2 DRAM with Si-based Vertical Channel Transistors (VCT). We demonstrate that a specifically designed BL attack pattern, featuring asymmetry and an appropriate toggling frequency, can trigger numerous bit-flips under JEDEC standards, especially at elevated temperatures. This uncovers an unexplored security vulnerability in VCT DRAM cells, with implications for data integrity in advanced memory technologies. Finally, we propose a mitigation strategy to improve cell’s resistance to the BL hammering.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.