Martin Vanbrabant, Jean-Pierre Raskin, Valeriya Kilchytska
{"title":"FD-SOI场效应管在低温下的热耦合","authors":"Martin Vanbrabant, Jean-Pierre Raskin, Valeriya Kilchytska","doi":"10.1016/j.sse.2025.109132","DOIUrl":null,"url":null,"abstract":"<div><div>This work studies the thermal coupling between two side-by-side FD-SOI MOSFETs at liquid nitrogen temperature in comparison to the room temperature one. The temperature rise experienced by the device due to the self-heating of a neighbor one is estimated by making a comparison to a referenced g<sub>m</sub>/I<sub>d</sub> curve as a function of chuck temperature. The impact of thermal coupling effects is studied on main digital (SS, V<sub>th</sub>, I<sub>on</sub>, I<sub>off</sub> and I<sub>on</sub>/I<sub>off</sub>) and analog (g<sub>m</sub> and g<sub>m</sub>/I<sub>d</sub>) figures of merit. We demonstrate that electrical parameters degradation caused by the operation (heating) of the neighbor device can be up to 50 % more important at 77 K than at 295 K.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"227 ","pages":"Article 109132"},"PeriodicalIF":1.4000,"publicationDate":"2025-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal coupling between FD-SOI FETs at cryogenic temperatures\",\"authors\":\"Martin Vanbrabant, Jean-Pierre Raskin, Valeriya Kilchytska\",\"doi\":\"10.1016/j.sse.2025.109132\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This work studies the thermal coupling between two side-by-side FD-SOI MOSFETs at liquid nitrogen temperature in comparison to the room temperature one. The temperature rise experienced by the device due to the self-heating of a neighbor one is estimated by making a comparison to a referenced g<sub>m</sub>/I<sub>d</sub> curve as a function of chuck temperature. The impact of thermal coupling effects is studied on main digital (SS, V<sub>th</sub>, I<sub>on</sub>, I<sub>off</sub> and I<sub>on</sub>/I<sub>off</sub>) and analog (g<sub>m</sub> and g<sub>m</sub>/I<sub>d</sub>) figures of merit. We demonstrate that electrical parameters degradation caused by the operation (heating) of the neighbor device can be up to 50 % more important at 77 K than at 295 K.</div></div>\",\"PeriodicalId\":21909,\"journal\":{\"name\":\"Solid-state Electronics\",\"volume\":\"227 \",\"pages\":\"Article 109132\"},\"PeriodicalIF\":1.4000,\"publicationDate\":\"2025-04-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Solid-state Electronics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0038110125000772\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid-state Electronics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0038110125000772","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Thermal coupling between FD-SOI FETs at cryogenic temperatures
This work studies the thermal coupling between two side-by-side FD-SOI MOSFETs at liquid nitrogen temperature in comparison to the room temperature one. The temperature rise experienced by the device due to the self-heating of a neighbor one is estimated by making a comparison to a referenced gm/Id curve as a function of chuck temperature. The impact of thermal coupling effects is studied on main digital (SS, Vth, Ion, Ioff and Ion/Ioff) and analog (gm and gm/Id) figures of merit. We demonstrate that electrical parameters degradation caused by the operation (heating) of the neighbor device can be up to 50 % more important at 77 K than at 295 K.
期刊介绍:
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.