基于谱图和深度残差网络的串联交流电弧故障检测方法

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Wenxin Dai, Xue Zhou, Zhigang Sun, Guofu Zhai
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引用次数: 0

摘要

电力设备的长时间和过度使用会加速电路电缆的老化,造成电弧故障。电弧故障的产生不仅会影响电力设备的工作性能,而且会带来安全隐患。因此,有必要对电路中的电弧进行检测。提出了一种基于谱图和深度残差网络的串联电弧故障检测框架。通过该框架可以将电流信号检测问题转化为图像识别问题。在这个框架中,当前信号被转换成频谱图,从而可以从多域角度对当前信号进行表征。然后,利用深度残差网络模型对谱图进行识别,确定电弧故障类型。最后,用实测数据验证了所提方法的有效性和准确性。结果表明,该方法能够实现准确的电弧故障检测,准确率达到97.50%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Series AC arc fault detection method based on spectrogram and deep residual network
The extended and excessive use of power equipment can hasten the aging of circuit cables, resulting in arc faults. The generation of arc fault will not only affect the performance of power equipment, but also bring about safety hazards. Therefore, it is necessary to detect arcing in circuits. This paper presents a framework for detecting series arc faults based on spectrogram and deep residual network. The problem of current signal detection can be converted into the problem of image recognition by this framework. In this framework, the current signal is converted into a spectrogram, which enables the characterisation of the current signal from a multi-domain perspective. Then, a deep residual network model is used to recognize the spectrogram and determine the type of arc fault. Finally, the current data is used to demonstrate the effectiveness and accuracy of the proposed method. The results show that the proposed method is able to achieve accurate arc fault detection with an accuracy of 97.50 %.
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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