Eunjeong Cho , Min Jeong Kim , Seyoung Oh , Woojin Park , Jongwon Yoon , Byungjin Cho
{"title":"CF4等离子体处理Ge提高Pt/Ti/Al2O3/p-Ge金属氧化物半导体memcapacitor器件可靠性","authors":"Eunjeong Cho , Min Jeong Kim , Seyoung Oh , Woojin Park , Jongwon Yoon , Byungjin Cho","doi":"10.1016/j.mssp.2025.109576","DOIUrl":null,"url":null,"abstract":"<div><div>Reliable modulation of artificial synapse device is crucial for the implementation of neuromorphic computing systems. Herein, we first demonstrated the reliable Ge-based memcapacitor which is enabled by Al<sub>2</sub>O<sub>3</sub>/Ge interface engineering based on CF<sub>4</sub> plasma treatment. Capacitance measurements show improved linearity and cycle-to-cycle variations in CF<sub>4</sub> plasma-treated memcapacitor, proving reliable synaptic modulation. The improvement in the synaptic behavior of the CF<sub>4</sub> plasma-treated memcapacitor is attributed to the reduction in Al<sub>2</sub>O<sub>3</sub>/Ge interface defect states by F-passivation on Ge surface. Low interface trap density, extracted using the high-low capacitance-voltage technique, and a relatively low contact potential difference, measured by Kelvin probe force microscopy, verify the reversible charge trapping and de-trapping via precisely controlled defect states within a narrow depletion region. This study highlights the potential of CF<sub>4</sub> plasma treatment as a successful strategy for enhancing the reliability of memcapacitors, paving the way for advanced neuromorphic computing technologies.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"194 ","pages":"Article 109576"},"PeriodicalIF":4.6000,"publicationDate":"2025-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancing device reliability in Pt/Ti/Al2O3/p-Ge metal-oxide-semiconductor memcapacitor via CF4 plasma treatment of Ge\",\"authors\":\"Eunjeong Cho , Min Jeong Kim , Seyoung Oh , Woojin Park , Jongwon Yoon , Byungjin Cho\",\"doi\":\"10.1016/j.mssp.2025.109576\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Reliable modulation of artificial synapse device is crucial for the implementation of neuromorphic computing systems. Herein, we first demonstrated the reliable Ge-based memcapacitor which is enabled by Al<sub>2</sub>O<sub>3</sub>/Ge interface engineering based on CF<sub>4</sub> plasma treatment. Capacitance measurements show improved linearity and cycle-to-cycle variations in CF<sub>4</sub> plasma-treated memcapacitor, proving reliable synaptic modulation. The improvement in the synaptic behavior of the CF<sub>4</sub> plasma-treated memcapacitor is attributed to the reduction in Al<sub>2</sub>O<sub>3</sub>/Ge interface defect states by F-passivation on Ge surface. Low interface trap density, extracted using the high-low capacitance-voltage technique, and a relatively low contact potential difference, measured by Kelvin probe force microscopy, verify the reversible charge trapping and de-trapping via precisely controlled defect states within a narrow depletion region. This study highlights the potential of CF<sub>4</sub> plasma treatment as a successful strategy for enhancing the reliability of memcapacitors, paving the way for advanced neuromorphic computing technologies.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"194 \",\"pages\":\"Article 109576\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800125003130\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800125003130","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Enhancing device reliability in Pt/Ti/Al2O3/p-Ge metal-oxide-semiconductor memcapacitor via CF4 plasma treatment of Ge
Reliable modulation of artificial synapse device is crucial for the implementation of neuromorphic computing systems. Herein, we first demonstrated the reliable Ge-based memcapacitor which is enabled by Al2O3/Ge interface engineering based on CF4 plasma treatment. Capacitance measurements show improved linearity and cycle-to-cycle variations in CF4 plasma-treated memcapacitor, proving reliable synaptic modulation. The improvement in the synaptic behavior of the CF4 plasma-treated memcapacitor is attributed to the reduction in Al2O3/Ge interface defect states by F-passivation on Ge surface. Low interface trap density, extracted using the high-low capacitance-voltage technique, and a relatively low contact potential difference, measured by Kelvin probe force microscopy, verify the reversible charge trapping and de-trapping via precisely controlled defect states within a narrow depletion region. This study highlights the potential of CF4 plasma treatment as a successful strategy for enhancing the reliability of memcapacitors, paving the way for advanced neuromorphic computing technologies.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.