考虑制造公差的低NF高隔离封装准环行器

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhan Chen;Chun-Xia Zhou;Wen Wu
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引用次数: 0

摘要

本文提出了一种低噪声、低插入损耗、高隔离、易于制造的封装准环行器(QC)。提出的QC由两个耦合器,三个连接的传输线(TLs)和一个共发射极放大器组成。通过设计放大器的幅度和相位,可以实现发送端(TX)和接收端(RX)端口之间的高度隔离,同时通过耦合器的隔离来抑制放大器的噪声。引入负群延迟(NGD)技术改变环路相位斜率,提高TX-ANT的传输带宽。此外,由于隔离性能对制造公差敏感,因此采用可重构负载以确保在宽频率范围内的高隔离。为了进行设计验证,设计并制作了一个QC,实现了带内TX-ANT IL为2.1 dB, ANT-RX IL为1.7 dB,噪声系数(NF)为2.3 dB。在1.925 ~ 2.09 GHz频率范围内,通过调节两个变容管的控制电压,所提出的环行器可以获得> ~ 40db的隔离度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Packaged Quasi-Circulators With Low NF and High Isolation Considering the Fabrication Tolerance
A packaged quasi-circulator (QC) with low noise, low insertion loss (IL), high isolation, and ease of manufacturing is proposed in this letter. The proposed QC is constructed by two couplers, three connecting transmission lines (TLs), and a common-emitter amplifier. High isolation between transmitter (TX) and receiver (RX) ports can be obtained using two-way signal cancellation by designing the amplitude and phase of the amplifier, while the noise from the amplifier is suppressed by the isolation of the coupler. The negative group delay (NGD) technique is introduced to change the slope of the loop phase to improve the TX-ANT transmission bandwidth. Furthermore, a reconfigurable load is employed to ensure high isolation within a wide frequency range since the isolation performance is sensitive to the fabrication tolerance. For design validation, a QC is designed and fabricated, which achieves the in-band TX-ANT IL of 2.1 dB, ANT-RX IL of 1.7 dB, and noise figure (NF) of 2.3 dB. By tuning two controlling voltage of varactors, the proposed circulator can obtain >40 dB isolation in the frequency range of 1.925–2.09 GHz.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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