一种优化W波段宽带垂直过渡的敏感数据标记策略

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Weihong Liu;Shuai Zhang;Yanbo Zhao;Zhiyuan Qu;Miao Zhao
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引用次数: 0

摘要

本文提出了一种用于w波段过孔垂直过渡结构自动化设计与优化的敏感数据标注方法。首先,引入动态阈值识别回波损失敏感区域;建立了基于人工神经网络(ann)的代理模型,建立了几何参数与$\vert S_{11}\vert $之间的映射关系,并通过实例验证了该模型的有效性。最后,利用遗传算法(GA)获得的优化结果与传统方法相比,在保持较高预测精度的同时,优化时间缩短38.29%,30 db RL带宽提高8.6 GHz,从而验证了所提出的数据标记方法进行建模和优化的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band
This letter proposes a sensitive data labeling method for the automated design and optimization of a W-band via-hole vertical transition structure. First, the dynamic thresholds are introduced to identify sensitive regions of return loss (RL). A surrogate model based on artificial neural networks (ANNs) is then developed to establish the mapping between geometric parameters and $\vert S_{11}\vert $ , with its validity demonstrated through the presentation of cases. Finally, optimization results, which maintain high prediction accuracy while reducing optimization time by 38.29% and improving the 30-dB RL bandwidth by 8.6 GHz compared with conventional methods, are obtained using genetic algorithm (GA), thereby demonstrating the effectiveness of the proposed data labeling method for modeling and optimization.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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