新型弧形源负电容可重构晶体管

IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Hongbo Ye;Junfeng Hu;Xinyu Zou;Zihan Sun;Xianglong Li;Yang Shen;Ziyu Liu;Xiaojin Li;Yanling Shi;Zhigang Mao;Yabin Sun
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引用次数: 0

摘要

本文提出了一种新型弧形源负电容可重构场效应晶体管(nc - esfet)。结合三维TCAD仿真和劳道-哈拉特尼科夫方程对其性能进行了评价。由于垂直电场的放大,铁电(FE)层产生的负电容改善了嵌入源周围的垂直线隧穿,并且无论对于n型还是p型程序,所提出的NC- esrfet都具有增强的NC效应。与传统纳米线负电容RFET (NC-RFET)相比,NC-ESRFE具有更大的临界FE层厚度和更低的亚阈值摆幅(SS),最低SS低于43 mV/dec,平均SS为63 mV/dec,比NC-RFET降低了33%。此外,嵌入式源DAS的直径比长度对NC增强的影响更大。通过合理选择结构参数,优化后的nc - esfet驱动电流提高54.4%,SS下降14.3%。研究结果表明,纳米esfet在未来低功耗应用中具有重要的应用价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel Negative Capacitance Reconfigurable Transistor With Arch-Shaped Source
Novel negative capacitance reconfigurable field effect transistor with arch-shaped source (NC-ESRFET) is proposed in this work. The performance is evaluated by combining 3D TCAD simulation with Laudau-Khalatnikov equation. Because of the amplified vertical electric field, the negative capacitance induced by ferroelectric (FE) layer improves the vertical line tunneling around the embedded source, and an enhanced NC effect is found in proposed NC-ESRFET, no matter for N-type or P-type program. Compared to the conventional nanowire negative capacitance RFET (NC-RFET), a larger critical FE layer thickness and lower subthreshold swing (SS) are obtained in NC-ESRFE, and the lowest SS is lower than 43 mV/dec and average SS is 63 mV/dec, which declines by 33% compared with NC-RFET. Besides, the diameter of embedded source DAS has greater influence on NC enhancement than the length LAS. By reasonably choosing the structure parameters, a 54.4% improvement on driven current and 14.3% decline in SS is obtained in the optimized NC-ESRFET. The results here demonstrate the great attentions of NC-ESRFET in future low power application.
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来源期刊
IEEE Transactions on Nanotechnology
IEEE Transactions on Nanotechnology 工程技术-材料科学:综合
CiteScore
4.80
自引率
8.30%
发文量
74
审稿时长
8.3 months
期刊介绍: The IEEE Transactions on Nanotechnology is devoted to the publication of manuscripts of archival value in the general area of nanotechnology, which is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.
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