用于评估混合动力牵引系统动力模块的虚拟测试台

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-04-09 DOI:10.1016/j.microrel.2025.115726

Massimo Sabato , Matteo Ermini , Enrico Stalio , Maurizio Tranchero , Federico Brusiani , Marco Colapietro , Anastasios Nanakos , Thierry Baritaud

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引用次数: 0

摘要

混合动力汽车（HEV）正变得越来越普遍，并使用诸如功率转换器（PC）之类的设备。由于其重要性，这些设备引起了研究人员的兴趣，因此近年来开发了创新的解决方案。目前的研究旨在提出一种能够帮助设计PC的电热模拟工具。它允许在低计算成本下评估任何多级PC和分析不同的操作条件，避免昂贵的测试。根据实验和文献结果对该工具进行了准确的验证。在这项工作中，评估了不同PC架构的损耗，其中包括使用IGBT3， EDT2和MOSFET作为功率模块的2电平和3电平功率转换器（PC）。通过对各种类型电路的功耗进行比较，证明了虚拟试验台的有效性和准确性，有助于电源变换器的设计。

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A virtual test bench oriented to power module evaluation for hybrid traction systems

Hybrid Electric Vehicle (HEV) are becoming widespread and uses devices such as Power Converter (PC). Due to their importance, these devices have attracted the interest of researchers, thus innovative solutions have been developed in recent years. The current study aims to present an electro-thermal simulation tool able to help in the design of a PC. It allows the evaluation of any multilevel PC and the analysis of different operating conditions at low computational cost and avoids expensive tests. The tool is accurately validated against experiments and literature results. In this work, the losses of different PC architectures are evaluated, these include both 2-Level and 3-Level Power Converters (PCs), using IGBT3, EDT2 and MOSFET as power modules. An exhaustive comparison between the dissipation of each typology is proposed and the presented virtual test bench is shown to be efficient and accurate in helping the design of a power converter.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.