{"title":"平面不对称空心阴极溅射系统的靶材扩散传输","authors":"D. A. Butnyakov, I. A. Sorokin, D. V. Kolodko","doi":"10.1007/s11090-025-10550-7","DOIUrl":null,"url":null,"abstract":"<div><p>This work investigates the features of a sputtering system with an asymmetrical planar hollow cathode discharge at 10–100 Pa pressures. The asymmetrical hollow cathode discharge occurs between two planar cathodes with different negative potentials. The problem of diffusion transport of sputtered material was formulated and numerically solved. To verify the results of the numerical model, tungsten coatings were deposited at a pressure of 40 Pa. The numerical model results based on the diffusion transport were compared with experimental data. The qualitative agreement between the model and experimental results was demonstrated. For substrates with positive curvature and a size smaller than the output aperture of the sputtering system, a characteristic increase in film thickness to the edges has been experimentally and numerically shown, which is associated with the diffusive nature of the sputtered material transport.</p></div>","PeriodicalId":734,"journal":{"name":"Plasma Chemistry and Plasma Processing","volume":"45 3","pages":"1029 - 1044"},"PeriodicalIF":2.6000,"publicationDate":"2025-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Diffusion Transport of Target Material for a Planar Asymmetrical Hollow Cathode Sputtering System\",\"authors\":\"D. A. Butnyakov, I. A. Sorokin, D. V. Kolodko\",\"doi\":\"10.1007/s11090-025-10550-7\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This work investigates the features of a sputtering system with an asymmetrical planar hollow cathode discharge at 10–100 Pa pressures. The asymmetrical hollow cathode discharge occurs between two planar cathodes with different negative potentials. The problem of diffusion transport of sputtered material was formulated and numerically solved. To verify the results of the numerical model, tungsten coatings were deposited at a pressure of 40 Pa. The numerical model results based on the diffusion transport were compared with experimental data. The qualitative agreement between the model and experimental results was demonstrated. For substrates with positive curvature and a size smaller than the output aperture of the sputtering system, a characteristic increase in film thickness to the edges has been experimentally and numerically shown, which is associated with the diffusive nature of the sputtered material transport.</p></div>\",\"PeriodicalId\":734,\"journal\":{\"name\":\"Plasma Chemistry and Plasma Processing\",\"volume\":\"45 3\",\"pages\":\"1029 - 1044\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2025-02-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Plasma Chemistry and Plasma Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s11090-025-10550-7\",\"RegionNum\":3,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasma Chemistry and Plasma Processing","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11090-025-10550-7","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Diffusion Transport of Target Material for a Planar Asymmetrical Hollow Cathode Sputtering System
This work investigates the features of a sputtering system with an asymmetrical planar hollow cathode discharge at 10–100 Pa pressures. The asymmetrical hollow cathode discharge occurs between two planar cathodes with different negative potentials. The problem of diffusion transport of sputtered material was formulated and numerically solved. To verify the results of the numerical model, tungsten coatings were deposited at a pressure of 40 Pa. The numerical model results based on the diffusion transport were compared with experimental data. The qualitative agreement between the model and experimental results was demonstrated. For substrates with positive curvature and a size smaller than the output aperture of the sputtering system, a characteristic increase in film thickness to the edges has been experimentally and numerically shown, which is associated with the diffusive nature of the sputtered material transport.
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Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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