Plasma Chemistry and Plasma Processing

SCI期刊
Plasma Chemistry and Plasma Processing
中文名称:
等离子化学和等离子处理
期刊缩写:
Plasma Chem. Plasma Process.
影响因子:
2.6
ISSN:
print: 0272-4324
on-line: 1572-8986
研究领域:
工程技术-工程:化工
创刊年份:
1981年
h-index:
57
自引率:
8.30%
Gold OA文章占比:
14.18%
原创研究文献占比:
100.00%
SCI收录类型:
Science Citation Index Expanded (SCIE) || Scopus (CiteScore)
期刊介绍英文:
Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
CiteScore:
CiteScoreSJRSNIPCiteScore排名
5.90.4800.912
学科
排名
百分位
大类:Physics and Astronomy
小类:Condensed Matter Physics
108 / 434
75%
大类:Materials Science
小类:Surfaces, Coatings and Films
34 / 132
74%
大类:Chemical Engineering
小类:General Chemical Engineering
79 / 273
71%
大类:Chemistry
小类:General Chemistry
119 / 408
70%
发文信息
中科院SCI期刊分区
大类 小类 TOP期刊 综述期刊
3区 物理与天体物理
3区 工程:化工 ENGINEERING, CHEMICAL
3区 物理:应用 PHYSICS, APPLIED
3区 物理:流体与等离子体 PHYSICS, FLUIDS & PLASMAS
WOS期刊分区
学科分类
Q3ENGINEERING, CHEMICAL
Q2PHYSICS, APPLIED
Q2PHYSICS, FLUIDS & PLASMAS
历年影响因子
2015年1.8110
2016年2.3550
2017年2.6580
2018年2.7680
2019年2.1780
2020年3.1480
2021年3.3370
2022年3.6000
2023年2.6000
历年发表
2012年89
2013年85
2014年86
2015年84
2016年92
2017年94
2018年77
2019年107
2020年88
2021年76
2022年73
投稿信息
出版周期:
Quarterly
出版语言:
English
出版国家(地区):
UNITED STATES
审稿时长:
6-12 weeks
出版商:
Springer US
编辑部地址:
SPRINGER, 233 SPRING ST, NEW YORK, USA, NY, 10013

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Chitosan Hydrogels with Antibacterial and Antifungal Properties: Enhanced Properties by Incorporating of Plasma Activated Water

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Dielectric Barrier Discharge Plasma Combined with Ce-Ni Mesoporous catalysts for CO2 splitting to CO

Pub Date : 2024-09-18 DOI: 10.1007/s11090-024-10512-5 Oleg V. Golubev, Anton L. Maximov

Recent Advances in Non-Thermal Plasma for Seed Germination, Plant Growth, and Secondary Metabolite Synthesis: A Promising Frontier for Sustainable Agriculture

Pub Date : 2024-09-14 DOI: 10.1007/s11090-024-10510-7 Mayura Veerana, Sohail Mumtaz, Juie Nahushkumar Rana, Rida Javed, Kamonporn Panngom, Bilal Ahmed, Khadija Akter, Eun Ha Choi
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