7能级堆叠纳米片GAA nmosfet中电子迁移率分析

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Michelly de Souza , Jaime Calçade Rodrigues , Lucas Mota Barbosa da Silva , Flavio Enrico Bergamaschi , Mikaël Cassé , Sylvain Barraud , Olivier Faynot , Marcelo Antonio Pavanello
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引用次数: 0

摘要

在本研究中,采用y函数方法提取载流子迁移率,对7能级堆叠纳米片GAA nmosfet的输运参数进行了实验评估。具体来说,研究了不同通道长度和纳米片宽度的晶体管的水平和垂直传导面对迁移率和退化因素的贡献。研究结果表明,虽然整体低场迁移率对纳米片宽度的依赖性较弱,但在短沟道晶体管中会有所降低。结果表明,整体迁移率退化系数与纳米片宽度有关,且水平和垂直贡献的平衡有所不同。值得注意的是,在水平面上,线性退化因子占主导地位,而在垂直平面上,二次退化因子占主导地位。这表明与水平面相比,侧壁的表面粗糙度散射更大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of electron mobility in 7-level stacked nanosheet GAA nMOSFETs
In this study, an experimental assessment of transport parameters in 7-level stacked nanosheet GAA nMOSFETs is conducted, employing the Y-Function methodology to extract carrier mobility. Specifically, the contribution of horizontal and vertical conduction planes to mobility and degradation factors is investigated for transistors with varying channel lengths and nanosheet widths. The findings reveal that while overall low-field mobility demonstrates weak dependency on nanosheet width, it suffers some reduction in short-channel transistors. Furthermore, the mobility degradation was analyzed, and the results indicate that overall mobility degradation coefficients depend on the nanosheet width, as the balance between horizontal and vertical contributions varies. Notably, while the linear degradation factor dominates the mobility degradation at horizontal planes, vertical planes exhibit a dominant quadratic degradation factor. This suggests larger surface roughness scattering at sidewalls compared to horizontal planes.
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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