超尺度gaafet中量子约束和准弹道输运的物理紧凑型模型

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yusi Zhao;Zhongshan Xu;Rongzheng Ding;Huawei Tang;Shaofeng Yu
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引用次数: 0

摘要

针对量子约束、准弹道输运和短通道效应等日益突出的物理效应,提出了一种基于物理的超尺度栅极场效应晶体管(gaafet)的紧凑模型。该模型采用基本物理方程的近似解析解,在保持计算效率的同时模仿真实的设备物理。除了预测终端特性外,它还能精确计算子带能量、量子质心、准弹道传输系数和静电标度长度。通过这些内部物理量,该模型不仅可以作为设备行为的简明表示,还可以揭示基本的物理见解。该模型与TCAD模拟和实验数据的一致性验证了其在广泛的偏置条件和GAAFET维度上的准确性,同时也突出了模型捕获的前沿技术节点的物理机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physics-Based Compact Modeling of Quantum Confinement and Quasi-Ballistic Transport in Ultra-Scaled GAAFETs
A physics-based compact model is developed for ultra-scaled gate-all-around field-effect transistors (GAAFETs), addressing increasingly prominent physical effects: quantum confinement, quasi-ballistic transport, and short channel effects (SCEs). The model employs approximate analytical solutions to the fundamental physical equations, mimicking true device physics while maintaining computational efficiency. In addition to predicting terminal characteristics, it accurately computes subband energies, quantum centroid, quasi-ballistic transmission coefficient, and electrostatic scaling length. Through these internal physical quantities, the model serves not merely as a concise representation of device behaviors but also reveals fundamental physical insights. The model’s verified consistency with TCAD simulations and experimental data confirms its accuracy across a wide range of bias conditions and GAAFET dimensions, while also highlighting the physical mechanisms captured by the model for leading-edge technology nodes.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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