{"title":"低至4k的MOSFET串联电阻的表征与建模","authors":"Yuhuan Lin;Zhizhao Ma;Shilong Li;Tianyue Wen;Yuxuan Zhou;Hao Su;Shenghua Zhou;Longyang Lin;Yida Li;Kai Chen","doi":"10.1109/JEDS.2025.3544738","DOIUrl":null,"url":null,"abstract":"MOSFET parasitic series resistance <inline-formula> <tex-math>$({R}_{SD})$ </tex-math></inline-formula> is an important parameter when channel length scales down. This paper presents a systematic study of <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> extracted from the mobility constant method down to 4 K. For the first time, the anomalous behavior of <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> with temperature lowering is interpreted and modeled by combined effects of dopant freeze-out and mobility. Excellent fit between the standard N/P-MOSFET measurement data and this model for 40 nm bulk device from leading foundry is shown from 300 K to 4 K. In addition, <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> change with width scaling combined with temperature effects is also discussed.","PeriodicalId":13210,"journal":{"name":"IEEE Journal of the Electron Devices Society","volume":"13 ","pages":"297-302"},"PeriodicalIF":2.0000,"publicationDate":"2025-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10899824","citationCount":"0","resultStr":"{\"title\":\"Characterization and Modeling of MOSFET Series Resistance Down to 4 K\",\"authors\":\"Yuhuan Lin;Zhizhao Ma;Shilong Li;Tianyue Wen;Yuxuan Zhou;Hao Su;Shenghua Zhou;Longyang Lin;Yida Li;Kai Chen\",\"doi\":\"10.1109/JEDS.2025.3544738\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"MOSFET parasitic series resistance <inline-formula> <tex-math>$({R}_{SD})$ </tex-math></inline-formula> is an important parameter when channel length scales down. This paper presents a systematic study of <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> extracted from the mobility constant method down to 4 K. For the first time, the anomalous behavior of <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> with temperature lowering is interpreted and modeled by combined effects of dopant freeze-out and mobility. Excellent fit between the standard N/P-MOSFET measurement data and this model for 40 nm bulk device from leading foundry is shown from 300 K to 4 K. In addition, <inline-formula> <tex-math>${R}_{SD}$ </tex-math></inline-formula> change with width scaling combined with temperature effects is also discussed.\",\"PeriodicalId\":13210,\"journal\":{\"name\":\"IEEE Journal of the Electron Devices Society\",\"volume\":\"13 \",\"pages\":\"297-302\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2025-02-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10899824\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Journal of the Electron Devices Society\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10899824/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of the Electron Devices Society","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10899824/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Characterization and Modeling of MOSFET Series Resistance Down to 4 K
MOSFET parasitic series resistance $({R}_{SD})$ is an important parameter when channel length scales down. This paper presents a systematic study of ${R}_{SD}$ extracted from the mobility constant method down to 4 K. For the first time, the anomalous behavior of ${R}_{SD}$ with temperature lowering is interpreted and modeled by combined effects of dopant freeze-out and mobility. Excellent fit between the standard N/P-MOSFET measurement data and this model for 40 nm bulk device from leading foundry is shown from 300 K to 4 K. In addition, ${R}_{SD}$ change with width scaling combined with temperature effects is also discussed.
期刊介绍:
The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.