用于高速I/O ESD保护的低电容和快速响应可控硅

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ruibo Chen;Feibo Du;Lu Li;Zhiwei Liu;Zhangming Zhu
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引用次数: 0

摘要

研制了一种用于高速I/O静电放电(ESD)保护的浮基n型晶体管触发可控硅(FBNTSCR)器件。该器件通过嵌入一个浮动基型n型晶体管作为触发元件来取代标准可控硅中的p阱结,使嵌入的双极能够在集电极-发射极击穿电压下雪崩,提供比传统LVTSCR更低的触发电压。此外,通过减轻与n阱/ p阱结相关的电容,可以实现较低的寄生电容。该设计还具有更短的固有可控硅路径,从而具有更低的导通电阻,更高的失效电流($l_{{t}{2}}$)和更低的过调电压以及更快的导通速度,所有这些都有利于CDM ESD保护性能。测量结果表明,与传统LVTSCR相比,FBNTSCR的触发电压降低了~40.8%,寄生电容降低了~68.9%,$l_{{t}{2}}$增强了~16.7%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low Capacitance and Fast Response SCR for High-Speed I/O ESD Protections
A floating-base N-type transistor triggered silicon-controlled rectifier (FBNTSCR) device is developed for high-speed I/O electrostatic discharge (ESD) protection. The device, constructed by embedding a floating-base N-type transistor as the trigger element replacing the P-well tie in a standard SCR, enables the embedded bipolar to be avalanched at the collector-emitter breakdown voltage, providing a lower trigger voltage than the conventional LVTSCR. Furthermore, a lower parasitic capacitance is achieved by mitigating the capacitance associated with the N-well/P-well junction. The proposed design also has a shorter inherent SCR path, resulting in lower on-resistance, higher failure current ( $l_{{t}{2}}$ ) and lower overshoot voltage as well as faster turn on speed, all of which benefit the CDM ESD protection performance. Measurement results show the FBNTSCR has ~40.8% reduced trigger voltage, ~68.9% reduced parasitic capacitance and ~16.7% enhanced $l_{{t}{2}}$ compared to the conventional LVTSCR.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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