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IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Device and Materials Reliability Pub Date : 2025-03-19 DOI:10.1109/TDMR.2025.3544351

Luca Cassano;Mihalis Psarakis

引用次数: 0

摘要

本特刊中的十篇文章介绍了超大规模集成电路和纳米技术系统中缺陷和故障容错领域的创新研究，为读者提供了有关这些具有挑战性的研究领域的最新进展和未来趋势的宝贵见解。这些文章的重点是电子设备和系统、集成电路、印刷模块的设计、技术和测试中的可靠性，以及用于可靠性和安全性预测、验证和设计确认的方法和工具。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Special Issue on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS 2023) in the IEEE Transactions on Device and Materials Reliability

The ten articles in this special issue present innovative research in the field of defect and fault tolerance in VLSI and nanotechnology systems and provide readers with valuable insights into the latest advances and future trends in these challenging research areas. The focus of these articles is on the reliability in the design, technology and testing of electronic devices and systems, integrated circuits, printed modules, as well as methodologies and tools used for reliability and security prediction, verification and design validation.

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来源期刊

IEEE Transactions on Device and Materials Reliability 工程技术-工程：电子与电气

CiteScore

4.80

自引率

5.00%

发文量

审稿时长

6-12 weeks

期刊介绍： The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.