烧结模附层的孔隙率和均匀性对功率循环性能的影响

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-10 DOI:10.1016/j.microrel.2025.115691

L. Mikutta, F. Otto, J. Schadewald

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引用次数: 0

摘要

银烧结是高可靠性芯片-衬底互连的最先进技术。然而，功率循环可靠性在很大程度上取决于烧结结合线的热性能和力学性能，这两者都取决于烧结层中孔隙率的大小和均匀性。本文对这种依赖关系进行了研究和讨论。对具有不同孔隙率和/或孔隙率分布的烧结样品进行功率循环试验，然后对样品进行失效分析。结果表明，在测试范围内，烧结层孔隙率及其分布不限制功率循环能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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On the influence of the porosity and homogeneity of sintered die-attach layers on the power cycling performance

Silver sintering is the state-of-the-art technology for highly reliable chip - substrate interconnects. The power cycling reliability, however, strongly depends on the thermal and mechanical properties of the sintered bond line, both of which are governed by the magnitude and the homogeneity of the porosity in the sintered layer. This dependency is investigated and discussed in this paper. Power cycling tests were performed on sintered samples having different porosities and/or porosity distributions after which the samples were subjected to failure analysis. It is concluded that - within the tested ranges - the sinter layer porosity and its distribution is not limiting the power cycling capability.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.