WLCSP封装产品的PBO分层和RDL腐蚀检测

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
K. Bidaj , Y. Chen , J. Chang , O. Atance-Loustaunau , F. Braud , M. Medda
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引用次数: 0

摘要

本文提出了一种基于物理故障而不是电气故障的PBO分层和RDL腐蚀检测新方法。通过理论分析和试验研究,提出了产生此类失效机制的最有效可靠应力。本研究可作为未来鉴定中选择最佳可靠性应力来检测PBO分层或RDL腐蚀问题的指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PBO delamination and RDL corrosion detection on WLCSP package products
This paper presents a novel approach based on physical failures instead of electrical failures for PBO delamination and RDL corrosion detection.
Moreover, most effective reliability stress to generate such failure mechanisms are presented through theory and experimental trials.
This study can serve as a guideline for selecting the best reliability stress to detect PBO delamination or RDL corrosion issues in future qualifications.
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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