基于温度的电子保险丝汽车配电系统的智能保护设计：数学背景、设计指南和基于能量方法的缺点

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-03-05 DOI:10.1016/j.microrel.2025.115635

M. Bernardoni, R. Illing, M. Tripolt, C. Djelassi-Tscheck

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引用次数: 0

摘要

本文概述了汽车配电系统中的配电设计要求，重点介绍了线束保护。虽然标准熔断保险丝仍广泛应用于汽车配电系统，但未来汽车平台的复杂性只能通过用电子保护取代熔断保险丝来实现。本文将分析电线保护方面的典型设计要求，哪些电子保护概念是可用的，以及如何确保安全的电线保护。此外，我们引入了一个正确的数学变换，描述了给定负载电流对所考虑的热系统（电线或eFuse）的影响，从而允许在等温域中正确表示负载、eFuse和电线。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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SMART protection design of automotive power distribution systems with temperature-based electronic fuses: Mathematical background, design guidelines and drawbacks of energy-based methods

This work presents an overview on the power distribution design requirements in automotive power distribution systems, with focus on wire harness protections. While standard melting fuses are still widely used in automotive power distribution systems, the complexity of the future automotive platforms can be enabled only by replacing melting fuses with electronic protections. This paper will analyze the typical design requirements in terms of wire protection, which electronic protections concepts are available and how a safe wire protection can be ensured. Moreover, we introduce a correct mathematical transformation that describes the effect of a given load current onto the considered thermal system (wire or eFuse), allowing the correct representation of load, eFuse, and wire, in the isothermal domain.

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.