基于故障前兆参数的多级电源系统可靠性预测

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
W.M. Liu , C. Chen , K.W. Xiao , Y. Yu , W. Zheng , M.T. Feng , G.F. Zhai
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引用次数: 0

摘要

复杂的电子系统具有多级特性,因此使用现有的可靠性建模方法准确模拟系统性能状态具有挑战性。本文提出了一种提取故障前兆参数(FPP)作为模型输入的多级可靠性预测模型。首先,构建电路级多应力仿真模型。其次,输入退化和故障信息,并通过灵敏度和相关性分析确定系统 FPP。最后,构建动态系统模型,以 FPPs 为输入,计算系统综合评估的可靠性。对一个特定供电系统的案例研究表明,该模型在保持预测准确性的同时,提高了模拟系统运行状态的能力。此外,论文还提供了一种结合故障模型物理和系统级可靠性预测的方法,并对各种研究方法进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliability prediction of multi-level power supply system based on Failure Precursor Parameters
Complex electronic systems exhibit multi-level characteristics, making it challenging to simulate the system performance states accurately using existing reliability modeling methods. This paper proposes a multi-level reliability prediction model that extracts Failure Precursor Parameters (FPPs) as model inputs. First, a circuit-level multi-stress simulation model is constructed. Second, the degradation and failure information is input, and system FPPs are identified through sensitivity and correlation analysis. Finally, a dynamic system model is constructed to calculate the reliability of the system's comprehensive evaluation, with FPPs as inputs. A case study on a specific power supply system demonstrates the model's improved ability to simulate the system's operational state while maintaining prediction accuracy. Additionally, the paper provides a method combining the physics of failure models and system-level reliability prediction, and various research methods are compared.
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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