高频平衡与紧凑的尺寸和低损耗的自包装充气悬浮线

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xin Guo;Yang Tao;Wen Wu
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引用次数: 0

摘要

本文基于低成本的自封装充气悬浮线及其专用扩展滤波器理论,提出并设计了一种工作频率高、插入损耗低的小型化宽带平衡器。将滤波理论推广如下:首先,通过明确半波长谐振器的失相输出、阻抗特性和小型化谐振器拓扑结构,可以根据所需的带内纹波和带宽,合成具有精确元件值的三端口平衡电路。其次,对基于自封装充气悬浮线的准集总元件进行定量设计,在紧凑的尺寸范围内获得高频低损耗平衡;第三,充分利用电路拓扑和物理结构的特点,直接馈电方式和双层准集总元件提供的强耦合强度保证了较宽的工作频带。为了验证,制作并测量了一个工作在10 GHz的四阶平衡器和一个工作在6 GHz的六阶平衡器。良好的性能验证了所提出的设计方法和低损耗紧凑自封装结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Frequency Balun With Compact Size and Low Loss on Self-Packaged Air-Filled Suspended Line
In this article, a kind of miniaturized broadband balun is proposed and designed with high operating frequency and low insertion loss based on the low-cost self-packaged air-filled suspended line and its specialized extended filter theory. The filter theory is extended as follows. First, through making clear the out-of-phase outputs, impedance property of half-wavelength resonator, and miniaturized resonator topology, the three-port balun circuit could be synthesized with exact element values, according to the required in-band ripple and bandwidth. Second, the quantitative design of quasi-lumped component based on self-packaged air-filled suspended line is executed to obtain low-loss balun at high frequency within the compact size. Third, taking full advantage of features of circuit topology and physical structure, the direct feeding method and the strong coupling strength provided by these double-layer quasi-lumped components guarantee a wide operating band. For validation, one fourth-order balun operating at 10 GHz and one sixth-order balun operating at 6 GHz are fabricated and measured. The good performance validates the proposed design approach and low-loss compact self-packaged structure.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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