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引用次数: 0
摘要
本文提出了一种用于表征具有片状布线的周期性非均匀微带线 S 参数的模型,该模型可以根据物理参数快速准确地计算出相应的散射参数。该模型采用基于方程的分析 (EBA) 解决方案,利用分段级联方法,并在对称重复区域内集成了有限差分时域 (FDTD) 方法的数值分析。这种方法可减少因准静态条件不足而产生的误差,从而提高精度。此外,该模型还集成了偏最小二乘法(PLS)机器学习(ML)来进行修正。它利用计算结果和电磁模拟结果之间的差异作为学习输入,预测新结构参数下的模型偏差,从而提高表征精度。根据全波仿真进行的验证证实,该模型与 EBA 解决方案相比,具有很强的一致性和更高的精确度,而且在数值求解和模型训练过程中不会降低计算效率。此外,该模型的准确性还通过全面的电路板制造和测量实验得到了证实。
Characterization of S-Parameters for Nonuniform Microstrip Lines With Tabbed Routing Using Analytical-Numerical Method and Machine Learning
In this article, a model for characterizing the S-parameters of periodic nonuniform microstrip lines with tabbed routing is proposed, which can calculate the corresponding scattering parameters quickly and accurately from the physical parameters. The model employs an equation-based analytical (EBA) solution, utilizing a piecewise cascade methodology and integrating numerical analysis from the finite difference time domain (FDTD) method within symmetrical repeated regions. This approach mitigates errors resulting from inadequate quasistatic conditions, thereby improving accuracy. Furthermore, the model integrates partial least squares (PLS) machine learning (ML) for correction. It leverages discrepancies between calculated and electromagnetic simulation results as learning inputs to predict model deviations under new structural parameters, thereby enhancing characterization precision. Validation against full-wave simulations confirms the model’s strong alignment and superior accuracy over the EBA solution, without compromising computational efficiency during numerical solution and model training. Moreover, the model’s accuracy is confirmed through comprehensive board fabrication and measurement experiments.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.