基于113gb /s PAM-4收发器的1.1 pj /b/Lane 1.8 tb /s芯片及均衡策略降低分数间隔0.5 ui ISI

IF 2.2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
G. Gangasani;A. Mostafa;A. Singh;D. Storaska;D. Prabakaran;K. Mohammad;M. Baecher;M. Shannon;M. Sorna;M. Wielgos;P. Jenkins;P. Ramakrishna;U. Shukla
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引用次数: 0

摘要

这封信使用5nm CMOS中的113 gb /s PAM4收发器来演示1.8 tb /s的芯片,通过模对模极短距离(XSR)封装内链路,在8端口配置中。在$F_{\textrm {baud}}/2$时,16通道的损耗范围从1到12db。这些通道上的晶片性能优于$\textrm {BER}\lt 10^{-9}$,而功耗<1.1 pj /b,每通道面积0.22 mm2。性能目标是通过收发器均衡策略实现的,该策略通过在数据路径中设计最小化0.5 ui ISI,并使用基于lut的TX FFE-3进行信号均衡和包络适应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 1.1-pJ/b/Lane, 1.8-Tb/s Chiplet Using 113-Gb/s PAM-4 Transceiver With Equalization Strategy to Reduce Fractionally Spaced 0.5-UI ISI in 5-nm CMOS
This letter uses 113-Gb/s PAM4 transceiver in 5-nm CMOS to demonstrate a 1.8-Tb/s chiplet, over die-to-die extremely short-reach (XSR) intrapackage links, in an 8-port configuration. The 16-channels range from 1 to 12 dB of loss at $F_{\textrm {baud}}/2$ . The chiplet performance over these channels is better than $\textrm {BER}\lt 10^{-9}$ , while consuming <1.1-pJ/b power and 0.22-mm2 area per lane. The performance targets are achieved using an transceiver equalization strategy which minimizes 0.5-UI ISI by design in the data path and using a LUT-based TX FFE-3 for signal equalization and envelope adaptation.
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来源期刊
IEEE Solid-State Circuits Letters
IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering
CiteScore
4.30
自引率
3.70%
发文量
52
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