基于载波寿命的SiC光导开关微波频率与输出功率的权衡

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ting He;Muyu Yi;Xinyue Niu;Jinmei Yao;Tao Xun;Langning Wang;Ting Shu
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引用次数: 0

摘要

研究了基于载流子寿命的VCSI 4h -碳化硅(SiC)光导半导体开关(pcss)中微波频率与输出功率之间的权衡关系。制备了两种不同钒掺杂浓度的pcss,并在0.5-2 GHz的频率范围内进行了测试。输出功率和调制深度比随微波频率的变化趋势表明微波频率和输出功率之间存在权衡关系。这两种器件的输出功率分别约为40w (@0.5 GHz)和160w (@0.5 GHz)。采用瞬态吸收(TA)技术,确定了两个器件的载流子寿命分别为30和460 ps,揭示了载流子寿命延长与输出功率增加之间的关系。然而,较长的载波寿命也导致较低的调制深度比。此外,当载波寿命不再是器件频率响应的主要限制因素时,上截止频率受到级间电容的限制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Trade-Off Between Microwave Frequency and Output Power in SiC Photoconductive Switches Based on Carrier Lifetime
The trade-off between microwave frequency and output power in VCSI 4H-silicon carbide (SiC) photoconductive semiconductor switch (PCSSs), based on carrier lifetime is investigated. PCSSs with two different vanadium doping concentrations are fabricated and tested across a frequency range of 0.5–2 GHz. The output power and modulation depth ratio trends with microwave frequency indicate a trade-off between microwave frequency and output power. The two devices exhibit output powers of approximately 40 W (@0.5 GHz) and 160 W (@0.5 GHz), respectively. Employing transient absorption (TA) techniques, the carrier lifetime of the two devices is determined to be 30 and 460 ps, revealing a relationship between longer carrier lifetime and increased output power. Nevertheless, the longer carrier lifetime also leads to a lower modulation depth ratio. Furthermore, when carrier lifetime ceases to be the primary constraining factor for the device’s frequency response, the upper cut-off frequency is constrained by the interstage capacitance.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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