原位O₂等离子体处理的HfO₂-ZrO₂超晶格HZO feram显示出增强的残余极化和改进的续航性能

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Dong-Ru Hsieh;Zi-Yang Hong;Wei-Ju Yeh;Jia-Chian Ni;Huai-En Luo;Yan-Kui Liang;Chun-Hsiung Lin;Tien-Sheng Chao
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引用次数: 0

摘要

在本研究中,制备了具有不同HfO2/ZrO2纳米层(NL)厚度的HfO2 - ZrO2超晶格(SL)、HfZrO2 (HZO)铁电随机存取存储器(FeRAMs)和1.5 nm的ZrO2种子层,并进行了原位氧等离子体处理,实验研究和讨论了它们的铁电性能和耐用性。与传统的HZO feram相比,HfO2和ZrO2 NL厚度为1 nm的HfO2 - ZrO2 SL HZO feram具有更高的两次残余极化($2{P} _{\text {r}}$) $43.32~\mu $ C/cm2,几乎无唤醒行为,更强的疲劳效应免疫能力和2.55 MV/cm的两次矫顽力场($2{E} _{\text {c}}$)。此外,通过使用原位O2等离子体处理的SL HZO薄膜,feram大大抑制了循环过程中氧空位的产生,进一步提高了疲劳效应的免疫力,并显着降低了脉冲$2{P} _{\text {r}}$降解率($\Delta 2{P} _{\text {r}}$ / $2{P} _{\text {r,pristine}}$)至36.48% after the endurance test of $10^{{9}}$ cycles can be achieved because the in situ O2 plasma-treated SL HZO FeRAMs possess a significantly enhanced HZO thin-film quality. Therefore, the in situ O2 plasma-treated SL HZO FeRAMs are very suitable candidates for embedded nonvolatile memory (eNVM) applications.
本文章由计算机程序翻译,如有差异,请以英文原文为准。
In Situ O₂ Plasma-Treated HfO₂–ZrO₂ Superlattice HZO FeRAMs Exhibiting Enhanced Remnant Polarization and Improved Endurance Performance
In this study, HfO2–ZrO2 superlattice (SL) HfZrO2 (HZO) ferroelectric random access memories (FeRAMs) with various HfO2/ZrO2 nanolamination (NL) thicknesses and a 1.5-nm ZrO2 seed layer were fabricated without and with in situ O2 plasma treatment to experimentally investigate and discuss their ferroelectricity and endurance performance. Compared with the conventional HZO FeRAMs, the HfO2–ZrO2 SL HZO FeRAMs with a HfO2 and ZrO2 NL thickness of 1 nm exhibited a higher two remnant polarization ( $2{P} _{\text {r}}$ ) of $43.32~\mu $ C/cm2, nearly wake-up free behavior, stronger fatigue effect immunity, and lower two coercive field ( $2{E} _{\text {c}}$ ) of 2.55 MV/cm. Furthermore, by using an in situ O2 plasma-treated SL HZO thin film for the FeRAMs to greatly suppress the oxygen vacancy generation during cycling, a further improved fatigue effect immunity and significantly reduced pulsed $2{P} _{\text {r}}$ degradation rate ( $\Delta 2{P} _{\text {r}}$ / $2{P} _{\text {r,pristine}}$ ) down to 36.48% after the endurance test of $10^{{9}}$ cycles can be achieved because the in situ O2 plasma-treated SL HZO FeRAMs possess a significantly enhanced HZO thin-film quality. Therefore, the in situ O2 plasma-treated SL HZO FeRAMs are very suitable candidates for embedded nonvolatile memory (eNVM) applications.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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