在平面非晶锡上的c轴定向HZO实现了高均匀性、击穿场、最终2Pr和耐久性

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zefu Zhao;Yu-Tsung Liao;Yu-Rui Chen;Yun-Wen Chen;Wan-Hsuan Hsieh;Jer-Fu Wang;Yu-An Chen;Hao-Yi Lu;Wei-Teng Hsu;Dai-Ying Lee;Ming-Hsiu Lee;C. W. Liu
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引用次数: 0

摘要

金属-铁电-金属(MFM)电容器具有沿沉积方向排列良好的正交相(o相)c轴,均匀的电场,可忽略疲劳,高残余极化(2Pr)为62美元;\mu $ C/cm2与非晶态TiN下层相比,晶体TiN与Hf0.5Zr0.5O2 (HZO)之间的大晶格错配形成了更大的o相HZO屏障。采用化学机械抛光(CMP)可获得粗糙度为0.3 nm的平面TiN,并通过原子力显微镜(AFM)进行测量。在正/负电压下,扁平非晶TiN表面的HZO表现出均匀的高击穿场(EBD),为4.8/−5.1 MV/cm。与粗糙TiN相比,扁平TiN由于在HZO中具有较弱且均匀的电场,且局域极值很少,从而减轻了氧空位(Vo)的形成。经过4E12次循环后,扁平TiN上的HZO显示出高达$56 \的最终2Pr;\mu $ C/cm2由于V $_{\text {o}}^{{2}+}$的小偶极子钉住。本工作展示了扁平非晶TiN实现均匀高2Pr、大EBD和高耐用性的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
C-Axis Oriented HZO on Flat Amorphous TiN Achieving High Uniformity, Breakdown Field, Final 2Pr, and Endurance
Metal-ferroelectric-metal (MFM) capacitors with flat amorphous TiN are demonstrated to achieve the c-axis of orthorhombic phase (o-phase) well-aligned along the deposition direction, uniform electric field, negligible fatigue, and a high remanent polarization (2Pr) of $62 \; \mu $ C/cm2. The large lattice misfit between crystalline TiN and Hf0.5Zr0.5O2 (HZO) creates a larger barrier to form the o-phase HZO as compared to the amorphous TiN underlayer. Using chemical–mechanical polishing (CMP) can obtain a 0.3 nm roughness flat TiN, measured by atomic force microscopy (AFM). HZO on flat amorphous TiN exhibits a uniform and high breakdown field (EBD) of 4.8/−5.1 MV/cm for positive/negative voltage. A flat TiN mitigates the formation of oxygen vacancies (Vo) as compared to the rough TiN due to the weak and uniform electric field with few local extremes in HZO. After 4E12 endurance cycles, the HZO on the flat TiN exhibits a high final 2Pr of $56 \; \mu $ C/cm2 due to small dipole pinning by V $_{\text {o}}^{{2}+}$ . This work demonstrates the way to achieve uniformly high 2Pr, large EBD, and high endurance by the flat amorphous TiN.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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