Zefu Zhao;Yu-Tsung Liao;Yu-Rui Chen;Yun-Wen Chen;Wan-Hsuan Hsieh;Jer-Fu Wang;Yu-An Chen;Hao-Yi Lu;Wei-Teng Hsu;Dai-Ying Lee;Ming-Hsiu Lee;C. W. Liu
{"title":"在平面非晶锡上的c轴定向HZO实现了高均匀性、击穿场、最终2Pr和耐久性","authors":"Zefu Zhao;Yu-Tsung Liao;Yu-Rui Chen;Yun-Wen Chen;Wan-Hsuan Hsieh;Jer-Fu Wang;Yu-An Chen;Hao-Yi Lu;Wei-Teng Hsu;Dai-Ying Lee;Ming-Hsiu Lee;C. W. Liu","doi":"10.1109/TED.2024.3502032","DOIUrl":null,"url":null,"abstract":"Metal-ferroelectric-metal (MFM) capacitors with flat amorphous TiN are demonstrated to achieve the c-axis of orthorhombic phase (o-phase) well-aligned along the deposition direction, uniform electric field, negligible fatigue, and a high remanent polarization (2Pr) of \n<inline-formula> <tex-math>$62 \\; \\mu $ </tex-math></inline-formula>\nC/cm2. The large lattice misfit between crystalline TiN and Hf0.5Zr0.5O2 (HZO) creates a larger barrier to form the o-phase HZO as compared to the amorphous TiN underlayer. Using chemical–mechanical polishing (CMP) can obtain a 0.3 nm roughness flat TiN, measured by atomic force microscopy (AFM). HZO on flat amorphous TiN exhibits a uniform and high breakdown field (EBD) of 4.8/−5.1 MV/cm for positive/negative voltage. A flat TiN mitigates the formation of oxygen vacancies (Vo) as compared to the rough TiN due to the weak and uniform electric field with few local extremes in HZO. After 4E12 endurance cycles, the HZO on the flat TiN exhibits a high final 2Pr of \n<inline-formula> <tex-math>$56 \\; \\mu $ </tex-math></inline-formula>\nC/cm2 due to small dipole pinning by V\n<inline-formula> <tex-math>$_{\\text {o}}^{{2}+}$ </tex-math></inline-formula>\n. This work demonstrates the way to achieve uniformly high 2Pr, large EBD, and high endurance by the flat amorphous TiN.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 1","pages":"222-227"},"PeriodicalIF":2.9000,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"C-Axis Oriented HZO on Flat Amorphous TiN Achieving High Uniformity, Breakdown Field, Final 2Pr, and Endurance\",\"authors\":\"Zefu Zhao;Yu-Tsung Liao;Yu-Rui Chen;Yun-Wen Chen;Wan-Hsuan Hsieh;Jer-Fu Wang;Yu-An Chen;Hao-Yi Lu;Wei-Teng Hsu;Dai-Ying Lee;Ming-Hsiu Lee;C. W. Liu\",\"doi\":\"10.1109/TED.2024.3502032\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Metal-ferroelectric-metal (MFM) capacitors with flat amorphous TiN are demonstrated to achieve the c-axis of orthorhombic phase (o-phase) well-aligned along the deposition direction, uniform electric field, negligible fatigue, and a high remanent polarization (2Pr) of \\n<inline-formula> <tex-math>$62 \\\\; \\\\mu $ </tex-math></inline-formula>\\nC/cm2. The large lattice misfit between crystalline TiN and Hf0.5Zr0.5O2 (HZO) creates a larger barrier to form the o-phase HZO as compared to the amorphous TiN underlayer. Using chemical–mechanical polishing (CMP) can obtain a 0.3 nm roughness flat TiN, measured by atomic force microscopy (AFM). HZO on flat amorphous TiN exhibits a uniform and high breakdown field (EBD) of 4.8/−5.1 MV/cm for positive/negative voltage. A flat TiN mitigates the formation of oxygen vacancies (Vo) as compared to the rough TiN due to the weak and uniform electric field with few local extremes in HZO. After 4E12 endurance cycles, the HZO on the flat TiN exhibits a high final 2Pr of \\n<inline-formula> <tex-math>$56 \\\\; \\\\mu $ </tex-math></inline-formula>\\nC/cm2 due to small dipole pinning by V\\n<inline-formula> <tex-math>$_{\\\\text {o}}^{{2}+}$ </tex-math></inline-formula>\\n. This work demonstrates the way to achieve uniformly high 2Pr, large EBD, and high endurance by the flat amorphous TiN.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"72 1\",\"pages\":\"222-227\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-12-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10798624/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10798624/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
C-Axis Oriented HZO on Flat Amorphous TiN Achieving High Uniformity, Breakdown Field, Final 2Pr, and Endurance
Metal-ferroelectric-metal (MFM) capacitors with flat amorphous TiN are demonstrated to achieve the c-axis of orthorhombic phase (o-phase) well-aligned along the deposition direction, uniform electric field, negligible fatigue, and a high remanent polarization (2Pr) of
$62 \; \mu $
C/cm2. The large lattice misfit between crystalline TiN and Hf0.5Zr0.5O2 (HZO) creates a larger barrier to form the o-phase HZO as compared to the amorphous TiN underlayer. Using chemical–mechanical polishing (CMP) can obtain a 0.3 nm roughness flat TiN, measured by atomic force microscopy (AFM). HZO on flat amorphous TiN exhibits a uniform and high breakdown field (EBD) of 4.8/−5.1 MV/cm for positive/negative voltage. A flat TiN mitigates the formation of oxygen vacancies (Vo) as compared to the rough TiN due to the weak and uniform electric field with few local extremes in HZO. After 4E12 endurance cycles, the HZO on the flat TiN exhibits a high final 2Pr of
$56 \; \mu $
C/cm2 due to small dipole pinning by V
$_{\text {o}}^{{2}+}$
. This work demonstrates the way to achieve uniformly high 2Pr, large EBD, and high endurance by the flat amorphous TiN.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.