光电门像素的电容性深沟槽界面表征和暗电流建模

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Samuel Tlemsani;Stéphane Ricq;Olivier Marcelot;Emilie De Pretto;Jean-Pierre Carrere;Thomas Dalleau;Pierre Magnan
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引用次数: 0

摘要

在CMOS图像传感器中,总暗电流(DC)是难以区分的几个贡献的总和,即使提取活化能。例如,在考虑界面生成时,可能仍然存在歧义,即哪个界面占主导地位,是正面,背面还是堑壕隔离。测试结构上的电特性是研究特定接口和提供补充信息(如钝化质量)的强大工具。在这项工作中,利用专用测试结构上的电容电压测量,研究了化学钝化和场效应钝化。得到了定量结果,使基于Shockley-Read-Hall (SRH)形式的直流计算成为可能。该模型取决于施加在沟槽上的电压,适合直接直流测量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Capacitive Deep Trench Interface Characterizations and Dark Current Modeling for Photogate Pixels
In a CMOS image sensor, the total dark current (DC) is the sum of several contributions that are difficult to discriminate, even if activation energies are extracted. For example, when considering the interface generation, there may still be ambiguities about which interface, whether the front-side, back-side, or trench isolation is dominant. Electrical characterizations on test structures are powerful tools for investigating specific interfaces and providing complementary information, such as passivation quality. In this work, chemical and field-effect passivation are studied using capacitance-voltage measurements on a dedicated test structure. Quantitative results are obtained, enabling the computation of DC based on the Shockley-Read–Hall (SRH) formalism. This model, which depends on the voltage applied to the trench, fits direct DC measurements.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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