基于Al0.8Sc0.2N低温分层沉积制备的高性能薄膜体声谐振器和滤波器

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhipeng Chen;Kaibin Xu;Tianyou Luo;Guowei Zhi;Yuhan Zhu;Peidong Ouyang;Guoqiang Li
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引用次数: 0

摘要

AlScN薄膜晶体质量差,严重阻碍了宽带薄膜体声谐振器(FBAR)滤波器的发展。为了解决这一问题,提出了一种低温分层沉积方法,利用脉冲激光沉积(PLD)在硅衬底上沉积单晶AlN缓冲层,然后通过物理气相沉积(PVD)溅射制备高质量的Al0.8Sc0.2N薄膜。结果表明,PLD制备的单晶AlN缓冲层具有较低的位错密度,这是由于PLD的低温生长和独特的优点。在单晶AlN缓冲层上生长Al0.8Sc0.2N薄膜,晶体质量、表面粗糙度和应力都得到了显著改善。由于Al0.8Sc0.2N薄膜的质量更高,所制备的FBAR具有187的高品质系数(FOM),比PVD方法提高了61.2%。在中心频率约为3.41 GHz时,设计的滤波器具有314 MHz的3db带宽,在通带中最小插入损耗为- 0.984 dB,最大插入损耗为- 1.646 dB。这项工作为推进高性能FBAR和高频宽带FBAR滤波器的发展提供了一种新的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Performance Film Bulk Acoustic Resonator and Filter Based on an Al0.8Sc0.2N Film Prepared by a Low-Temperature Staged Deposition Method
The poor crystal quality of AlScN films is a serious obstacle to the development of broadband film bulk acoustic resonator (FBAR) filters. To address this issue, a low-temperature staged deposition method was proposed, in which a single-crystalline AlN buffer layer was deposited on a silicon substrate using pulsed laser deposition (PLD) and subsequently sputtered to produce a high-quality Al0.8Sc0.2N film by physical vapor deposition (PVD). The results showed that the single-crystalline AlN buffer layer created by PLD had a low dislocation density, which was attributable to the low-temperature growth and unique benefits of PLD. Growth of the Al0.8Sc0.2N film on the single-crystalline AlN buffer layer resulted in significant improvements in crystal quality, surface roughness, and stress. The produced FBAR has a high figure of merit (FOM) of 187, a 61.2% improvement over the PVD method, owing to the higher quality of the Al0.8Sc0.2N film. At a center frequency of approximately 3.41 GHz, the designed filter had a 3-dB bandwidth of 314 MHz with a minimum insertion loss of −0.984 dB and a maximum insertion loss of −1.646 dB in the passband. This work presents a novel approach for advancing the development of high-performance FBARs and high-frequency broadband FBAR filters.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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